MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第591页

MIL-STD-883F METHOD 5004.11 18 June 2004 1 METHOD 5004.11 SCREENING PROCEDURES 1. PURPOSE . This method est ablis hes sc reening pr ocedures for t otal l ot sc reening of micr oelect ronic s to as sis t in achievi ng lev…

MIL-STD-883F

METHOD 5003

20 November 1969

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MIL-STD-883F

METHOD 5004.11

18 June 2004

METHOD 5004.11

SCREENING PROCEDURES

1. PURPOSE

. This method establishes screening procedures for total lot screening of microelectronics to assist in

achieving levels of quality and reliability commensurate with the intended application. It must be used in conjunction with

other documentation such as appendix A of MIL-PRF-38535 or an applicable device specification to establish the design,

material, performance, control, and documentation requirements which are needed to achieve prescribed levels of device

quality and reliability. In recognition of the fact that the level of screening has a direct impact on the cost of the product as

well as its quality and reliability, two standard levels of screening are provided to coincide with two device classes or levels

of product assurance. Since it is not possible to prescribe an absolute level of quality or reliability which would result from a

particular screening level or to make a precise value judgment on the cost of a failure in an anticipated application, two

levels have been arbitrarily chosen. The method provides flexibility in the choice of conditions and stress levels to allow the

screens to be further tailored to a particular source, product, or application based on user experience. The user is cautioned

to collect experience data so that a legitimate value judgment can be made with regard to specification of screening levels.

Selection of a level better than that required for the specific product and application will, of course, result in unnecessary

expense and a level less than that required will result in an unwarranted risk that reliability and other requirements will not be

met. In the absence of specific experience data, the class B screening level is recommended for general applications.

Guidance in selecting screening levels or predicting the anticipated reliability for microcircuits may be obtained from

MIL-HDBK-217 Military Standardization Handbook Reliability Prediction.

NOTE: Reference to method 5004 on a stand alone basis (not indicating compliance or noncompliance to 883) requires

full compliance to 1.2.1 of this standard.(See 1.2.2)

2. APPARATUS

. Suitable electrical measurement equipment necessary to determine compliance with applicable

acquisition documents and other apparatus as required in the referenced test methods.

3. PROCEDURE

3.1 Screening procedures for microcircuits

. Screening of microcircuits shall be conducted as described in 3.1.1 through

3.1.19 and in the sequence shown except where variations in sequence are specifically allowed herein. This provision does

not preclude the performance of additional tests or inspection which may be required for specific devices or which may be

desirable to optimize results of screening; however, any such special test inspections shall be subjected to the requirements

of A.3.4.3 of appendix A of MIL-PRF-38535. Any burn-in in addition to that specified is only permitted when documented in

the lot records, and any failures shall be counted in applicable PDA calculations. Where end-point or post-test

measurements are required as part of any given test method used in the screening procedure and where such post test

measurements are duplicated in the interim (post burn-in) or final electrical tests that follow, such measurements need not

be duplicated and need be performed only as part of the interim (post burn-in) or final electrical tests. Devices which pass

screening requirements of a higher reliability level shall be considered to meet the screening requirements of all lower levels.

In no case shall screening to a lower level than that specified be permitted. Microcircuits which are contained in packages

which have an inner seal or cavity perimeter of 2 inches or more in total length or which have a package mass of 5 grams or

more may be treated in accordance with 3.2 as an alternative to 3.1.5.

Qualified manufacturers list (QML) manufacturers who are certified and qualified to MIL-PRF-38535 or who have been

granted transitional certification to MIL-PRF-38535 may modify the class level B screening table (table I) as specified in the

applicable device specification or drawing and as permitted in 1.2 of MIL-STD-883 provided the modification is contained in

the manufacturers quality management (QM) plan and the "Q" or "QML" certification mark, is marked on the devices. For

contractor prepared drawings with specific references to individual test methods of MIL-STD-883 (e.g., method 1010,

method 2001, etc.), these test methods may not be modified by a QML manufacturer without the knowledge and approval of

the acquiring activity.

MIL-STD-883F

METHOD 5004.11

18 June 2004

3.2 Constant acceleration procedure for large packages (see Table 1, Section 3.1.5). Microcircuits which are contained

in packages which have an inner seal or cavity perimeter of 2 inches or more in total length or have a package mass of 5

grams or more may be treated in accordance with provisions below as an alternate to the procedure of Table 1, Section

3.1.5.

Delete test condition E and replace with test conditions as specified in the applicable device specification. Unless

otherwise specified in the acquisition document, the stress level for large, monolithic microcircuit packages shall not be

reduced below test condition D. If the stress level specified is below condition D, the manufacturer must have data to justify

this reduction and this data must be maintained and available for review by the preparing or acquiring activity. The minimum

stress level allowed is condition A.

3.3 Alternate procedures to method 2010 internal visual for microcircuits

. Alternate procedures may be used on an

optional basis on any microcircuit, provided that the conditions and limits of the alternate procedures are submitted to, and

approved by the preparing activity, or the acquiring activity.

3.3.1 Alternate procedures

Alternate 1: The deletions and the changes stated in 3.3.1a are allowable for class level B product only if the

requirements of 3.3.1b and 3.3.1c are imposed and any of the following conditions exists.

1. Minimum horizontal geometry is less than 3 micrometers (µm).

2. Interconnects consisting of two or more levels.

3. Opaque materials mask design features.

a. For inspection of each microcircuit die, delete the inspection criteria of 3.1.1, 3.1.2, 3.1.3, 3.1.4, 3.1.5, 3.1.6, 3.1.7,

and 3.2.5 of condition B of method 2010 and for use in conjunction with alternate procedures add 3.1.1.1, 3.1.1.2,

3.1.1.6, 3.1.3, 3.1.4, and 3.2.5 to the low magnification inspection of method 2010.

b. Temperature cycling (3.1.4). The minimum total number of temperature cycles shall be 50. The manufacturer may

reduce the number of temperature cycles from 50 to the 10 required as part of normal screening based upon data

justifying the reduction in temperature cycles, approved by the preparing activity and an approved plan which shall

include the following criteria:

(1) Reduction of test must be considered separately for each wafer fabrication line and each die family.

(2) The manufacturer shall demonstrate that the wafer fabrication line that produces product which will involve

reduction of temperature cycles is capable and in process control.

(3) The manufacturer shall perform a high magnification visual inspection on a small sample of devices

(e.g., 5(0)) to monitor the process. This inspection may be performed at wafer level.

c. Special electrical screening tests shall be applied to each microcircuit die at the wafer, individual die (chip) or

packaged microcircuit level in accordance with the requirements of 3.3.2 of MIL-STD-883, method 5004. The

conditions and limits of the electrical tests (in table III format) shall be submitted to the preparing activity for

approval and subsequently maintained on file with the qualifying activity. These special screens are in addition to

the required electrical parametric tests which the device must pass and shall be designed to screen out devices

with defects that were not inspected to the full criteria of 3.1.3 (internal visual). Due to the nature of these tests,

they are not to be repeated as part of the qualification and quality conformance procedures in accordance with

method 5005.

Alternate 2: The requirements and conditions for use of this alternate are contained in appendix A of this method.

This option applies to both class level B and class level S microcircuits.