MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第618页

MIL-STD-883F METHOD 5005.14 18 June 2004 2 3.1 Qualif icat ion proc edure for clas s level S micr ocir cuit s . 3.1.1 Qual ific ation f or cl ass l evel S QML-38535 l ist ing. Qualifi cati on test ing for clas s level S …

MIL-STD-883F

METHOD 5005.14

18 June 2004

METHOD 5005.14

QUALIFICATION AND QUALITY CONFORMANCE PROCEDURES

1. PURPOSE.

This method establishes qualification and quality conformance inspection procedures for microelectronics

to assure that the device and lot quality conforms with the requirements of the applicable acquisition document. The full

requirements of groups A, B, C, D, and E tests and inspections are intended for use in initial device qualification,

requalification in the event of product or process change, and periodic testing for retention of qualification. Groups A and B

tests and inspections are required for quality conformance inspection on individual inspection lots as a condition for

acceptance for delivery. Groups C and D tests are required for quality conformance inspection on a periodic basis as a

condition for acceptance for delivery. Group E tests are qualification and quality conformance procedures to be utilized only

for radiation hardness assurance levels as specified in table V. In general, it is intended that the device class level to which

qualification or quality conformance inspection is conducted would be the same device class level to which screening

procedures (in accordance with method 5004) are conducted. However, it is permissible for qualification or quality

conformance procedures to be specified at a higher quality level (in no case shall a lower level be permitted) to reduce the

potential percent-defective. It is also permissible to specify tightened inspection criteria for individual subgroups where

experience indicates justifiable concern for specific quality problems.

NOTE: Reference to method 5005 on a stand alone basis (not indicating compliance or noncompliance to 883) requires

full compliance to 1.2.1 of this standard (see 1.2.2 of this standard).

2. APPARATUS.

Suitable electrical measurement equipment necessary to determine compliance with the requirements

of the applicable acquisition document and other apparatus as required in the referenced test methods.

3. PROCEDURE.

The procedure contained in 3.1, 3.2, or 3.3, as applicable to the microcircuit type and class, shall apply

for all qualifications and quality conformance inspection requirements. Subgroups within a group of tests may be performed

in any sequence but individual tests within a subgroup (except group B, subgroup 2) shall be performed in the sequence

indicated for groups B, C, D, and E tests. Where end-point electrical measurements are required for subgroups in groups B,

C, D, and E testing, they shall be as specified in the applicable device specification or drawing. Where end-point

measurements are required but no parameters have been identified in the acquisition document for that purpose, the final

electrical parameters specified for 100 percent screening shall be used as end-point measurements. Microcircuits which are

contained in packages which have an inner seal or cavity perimeter of 2 inches or more in total length or have a package

mass of 5 grams or more may be treated in accordance with the optional provisions below, where applicable.

Constant acceleration. Delete test condition E and replace with test condition as specified in the applicable device

specification or drawing. Unless otherwise specified, the stress level for large monolithic microcircuit packages shall not be

reduced below test condition D. If the stress level specified is below condition D, the manufacturer must have data to justify

this reduction and this data must be maintained and available for review by the preparing or acquiring activity. The minimum

stress level allowed is condition A.

Qualification and quality conformance inspection requirements for radiation hardness assured devices are in addition to the

normal classes level S and level B requirements. Those requirements for each of the specified radiation levels (M, D, P, L,

R, F, G and H) are detailed in table V.

Qualified manufacturers list (QML) manufacturers' who are certified and qualified to MIL-PRF-38535 or who have been

grated transitional certification to MIL-PRF-38535 may modify the class level B tables (tables I, IIb, III, and IV) as specified in

the applicable device specification or Standard Microcircuit Drawing and as permitted in 1.2 of MIL-STD-883 provided the

modification is contained in the manufacturer's Quality Management (QM) plan and the "Q" or "QML" certification mark is

marked on the devices. For contractor prepared drawings with specific references to individual test methods of MIL-STD-

883 (e.g., method 1010, method 2002, etc.), these test methods may not be modified by a QML manufacturer without the

knowledge and approval of the acquiring activity.

MIL-STD-883F

METHOD 5005.14

18 June 2004

3.1 Qualification procedure for class level S microcircuits.

3.1.1 Qualification for class level S QML-38535 listing.

Qualification testing for class level S microcircuits shall be in

accordance with appendix A of MIL-PRF-38535.

3.1.2 Steady-state life test.

In the case of multiple sublots contained in the class level S inspection lot, the sample size

number shall be selected from the sublots in the nearest whole number of devices proportionately to the number of devices

in each sublot. Where this results in less than 10 samples from any sublot, additional samples shall be selected from that

sublot(s) to provide a minimum of 10 samples from each sublot. Any sublot which exhibits more than one failure shall be

rejected from the inspection lot.

3.2 Quality conformance inspection procedures for class level S microcircuits.

Each class level S quality conformance

inspection lot shall be assembled in accordance with the class level S requirements of appendix A of MIL-PRF-38535.

Quality conformance testing shall be in accordance with tables I, IIa, and IV.

3.2.1 Notification of nonconformance.

Whenever any of the following occurs, the qualifying activity shall be immediately

notified:

a. The number of failures in a single subgroup of table IIa exceeds the acceptance number on two successive lots

(applicable to subgroups 2b, 2c, 2d, 5, and 6).

b. The number of failures for the resubmitted sample in accordance with A.4.3.3.1 of appendix A of MIL-PRF-38535

exceeds the acceptance number on two successive lots on the following subgroups: 1, 2a, 2b, 2d, and 4.

c. For a given device type withdrawal from quality conformance testing for any reason on two successive lots.

d. Following initial notification, the manufacturer shall provide the qualifying agency or its designated representative

with data which indicates the reason(s) for the reported nonconformance, contributing factors, and proposed

corrective action.

e. Two successive lots failing group E testing, or 10 percent or more of the lots requiring the add-on sampling

procedure.

In the absence of timely compliance with the above, or corrective action acceptable to the qualifying activity, action may

be taken to remove the product from the class level S QML-38535.

3.3 Qualification and quality conformance inspection procedures for class level B microcircuits.

Qualification or quality

conformance inspection for microcircuits shall be conducted as described in the groups A, B, C, D, and E tests of tables I, II,

III, IV, and V herein and as specified in the applicable device specification. For quality conformance inspection, each

inspection lot (sublot) shall pass groups A, B and (when applicable) E test (or be accepted in accordance with 3.5 herein),

and the periodic group C and D tests shall be in accordance with appendix A of MIL-PRF-38535.

3.4 Acceptance procedure.

Acceptance numbers, provisions for resubmission, and criteria for acceptance or rejection of

lots shall be as specified herein and in the applicable device specification or drawing.

3.5 Sample selection.

Samples shall be randomly selected from the assembled inspection lot in accordance with

appendix A of MIL-PRF-38535 (and in accordance with table V herein for group E) after the specified screen requirements of

method 5004 have been satisfactorily completed. Where use of electrical rejects is permitted, unless otherwise specified,

they need not have been subjected to the temperature/ time exposure of burn-in.

3.5.1 Alternate group A testing

. Alternate procedures for performing group A inspection on each inspection lot or sublot

may be used at the manufacturer's option provided that the qualifying activity has previously approved the alternate

procedure and flow being used by the manufacturer. A different operator shall check the entire test setup and verify the use

of the correct test program prior to testing the group A sample.

MIL-STD-883F

METHOD 5005.14

18 June 2004

3.5.1.1 Inspection lot sample selection. When this option is used, test samples for each individual group A subgroup

shall be randomly selected from the inspection lot after 100 percent screening of that subgroup (or subgroups, in the event

that multiple subgroups are tested at the same temperature in sequence with the same test program). All devices in the

inspection lot or sublot shall be available for selection as a test sample and a fully random sample shall be selected from the

total population of devices.

3.5.1.2 Concurrent sample selection

. When this option is used, test samples from each individual group A subgroup(s)

shall be randomly selected concurrent with the 100 percent screening of that subgroup(s) and tested subsequent to

screening each individual device of that subgroup(s). When this option is used, the following requirements apply:

a. A documented verification methodology and operating procedure shall be set up to assure the integrity of the total

test system, that the product is being tested with correct test conditions and that all required screening and group

A testing is being performed.

b. The group A samples shall be sorted out separately from the balance of the lot and the sample size verified. If

because of higher than expected yield loss, the number of samples tested are less than the required sample size,

(116 units), then additional samples shall be randomly selected and tested.

c. Each group A reject shall be sorted out separately.

d. All screening rejects shall be segregated from the acceptable product and the physical count verified against the

test system attribute data.

e. When sorting (e.g., speed or power) is completed during the final electrical screening, each individual device type

screened shall have a full group A sample selected and tested.

f. For small lots, where the lot size is less than the required sample size (116 units) each device in the lot shall be

double tested (i.e., 100 percent screening and 100 percent group A).