MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第623页

MIL-STD-883F METHOD 5005.14 18 June 2004 7 TABLE IIa. Gr oup B test s for clas s level S devices - Continued. 1 / Test MIL-STD-883 Quant ity ( accept no.) Sample si ze no. Accept number Method Condition Subgroup 6 a. End…

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MIL-STD-883F
METHOD 5005.14
18 June 2004
6
TABLE IIa. Group B tests for class level S devices. 1/
Test
MIL-STD-883 Quantity (accept no.)
Sample size no.
accept no.
Method Condition
Subgroup 1
a. Physical dimensions 2
/
b. Internal water-vapor
content 2
/ 3/
2016
1018
5,000 ppm maximum water
content at 100°C
2(0)
3(0) or 5(1) 4
/
Subgroup 2 5/
a. Resistance to solvents
b. Internal visual and
mechanical
c. Bond strength
(1) Thermocompression
(2) Ultrasonic
(3) Flip-chip
(4) Beam lead
d. Die shear or substrate
attach strength test
2015
2013,
2014
2011
Failure criteria from design and
construction requirements of
applicable acquisition document
1. Test condition C or D
2. Test condition C or D
3. Test condition F
4. Test condition H
In accordance with method
2019 or 2027 for the applicable
die size
3(0)
2(0)
Sample size 6
/
number = 22, c = 0
3(0)
Subgroup 3
Solderability 7
/
2003
Soldering temperature
of 245°C ±5°C
Sample size
number = 22, c = 0
Subgroup 4 2/
a. Lead integrity 8
/
b. Seal
(a) Fine
(b) Gross
c. Lid torque 9
/
2004
1014
2024
Test condition B2, lead fatigue
As applicable
As applicable
Sample size
number = 45, c = 0
Subgroup 5 10/
a. End-point electrical
parameters 11
/
b. Steady state life
c. End-point electrical
parameter 11
/
1005
As specified in the applicable
device specification
Test condition C, D, or E
As specified in the applicable
device specification
Sample size
number = 45, c = 0
See footnotes at end of table.
MIL-STD-883F
METHOD 5005.14
18 June 2004
7
TABLE IIa. Group B tests for class level S devices - Continued. 1/
Test
MIL-STD-883 Quantity (accept no.)
Sample size no.
Accept number
Method Condition
Subgroup 6
a. End-point electrical
parameters
b. Temperature cycling
c. Constant acceleration
d. Seal
(a) Fine
(b) Gross
e. End-point electrical
parameters
1010
2001
1014
As specified in the
applicable device
specification
Condition C, 100 cycles
minimum
Test condition E: Y
1
orientation only
As specified in the
applicable device
specification
Sample size
Number = 15, c = 0
Subgroup 7 12/
1
/ Electrical reject devices from that same inspection lot may be used for all subgroups when end-point measurements
are not required provided that the rejects are processed identically to the inspection lot through pre burn-in electrical
and provided the rejects are exposed to the full temperature/ time exposure of burn-in.
2
/ Not required for qualification or quality conformance inspections where group D inspection is being performed on
samples from the same inspection lot.
3
/ This test is required only if it is a glass-frit-sealed package. Unless handling precautions for beryllia packages are
available and followed method 1018, procedure 3 shall be used. See Subgroup 6 of table IV.
4
/ Test three devices; if one fails, test two additional devices with no failures. At the manufacturers option, if the initial
test sample (i.e., 3 or 5 devices) fails, a second complete sample may be tested at an alternate laboratory that has
been granted current suitability status by the qualifying activity. If this sample passes, the lot shall be accepted
provided the devices and data from both submissions is submitted to the qualifying activity along with five additional
devices from the same lot. If sample size (accept number) of 5(1) is used to pass the lot, the manufacturer shall
evaluate his product to determine the reason for the failure and whether the lot is at risk.
5
/ Resistance to solvents testing required only on devices using inks or paints as a marking medium.
6
/ Unless otherwise specified, the sample size number for conditions C and D is the number of bond pulls selected from
a minimum number of four devices, and for condition F or H is the number of dice (not bonds).
*
MIL-STD-883F
METHOD 5005.14
18 June 2004
8
7/ All devices submitted for solderability test shall be in the lead finish that will be on the shipped product and which has
been through the temperature/time exposure of burn-in except for devices which have been hot solder dipped or
undergone tin-lead fusing after burn-in. The sample size number applies to the number of leads inspected except in
no case shall less than three devices be used to provide the number of leads required.
8
/ The sample size number of 45 for lead integrity shall be based on the number of leads or terminals tested and shall be
taken from a minimum of 3 devices. All devices required for the lead integrity test shall pass the seal test and lid
torque test, if applicable, (see 9
/) in order to meet the requirements of subgroup 4. For pin grid array leads and rigid
leads, use method 2028. For leaded chip carrier packages, use condition B1. For leadless chip carrier packages only,
use test condition D and a sample size number of 15 based on the number of pads tested taken from 3 devices
minimum. Seal test (subgroup 4b) need be performed only on packages having leads exiting through a glass seal.
9
/ Lid torque test shall apply only to glass-frit-sealed packages.
10
/ The alternate removal-of-bias provisions of 3.3.1 of method 1005 shall not apply for test temperature above 125°C.
11
/ Read and record group A subgroups 1, 2, and 3.
12
/ Subgroup 7 has been deleted from table IIa. The requirements for ESD testing are specified in appendix A of
MIL-PRF-38535.