MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第641页
MIL-STD-883F METHOD 5008.9 18 December 2000 1 METHOD 5008.9 TEST PROCEDURES FOR HYBRI D AND MULTICHIP MICROCI RCUITS Method 5008 is cancel ed effec tive 1 J une 1993. It i s s uperseded by MI L-PRF-38534. For Federal Sto…
MIL-STD-883F
METHOD 5007.6
19 August 1994
4
TABLE I. Wafer lot acceptance tests - Continued.
Test
Conditions 1/ Limits 3/ Sampling plan
6. Gold backing
thickness
(when appli-
cable)
All readings
shall be
recorded.
In accordance with
approved design
nominal thickness and
tolerance.
One wafer (or
monitor) per lot.
Reject lot if any
measurement ex-
ceeds limits or
revert to test of
each wafer.
1
/ The manufacturer shall have documented procedures for performing each required test. These procedures shall
be made available to the qualifying activity or acquiring activity upon request.
2
/ This test is not required when the finished wafer design thickness is greater than 10 mil.
3
/ Approved design nominal values or tolerances shall be documented in the manufacturer’s baseline
documentation.
*
MIL-STD-883F
METHOD 5008.9
18 December 2000
1
METHOD 5008.9
TEST PROCEDURES FOR HYBRID AND MULTICHIP MICROCIRCUITS
Method 5008 is canceled effective 1 June 1993. It is superseded by MIL-PRF-38534. For Federal Stock classes other
than 5962, the following paragraphs of MIL-PRF-38534 are provided to replace method 5008.
Superseded
method 5008
MIL-PRF-38534 Requirement
3.2 Element evaluation C.3 Element evaluation Element evaluation
3.3 Process control C.4 Process control Process control
3.4 Device screening C.5 Device screening Screening
3.5 Quality conformance evaluation C.6 Conformance
Inspection and Periodic
Inspection
QCI
MIL-STD-883F
METHOD 5008.9
18 December 2000
2
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