MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第642页

MIL-STD-883F METHOD 5008.9 18 December 2000 2 This page i ntenti onally lef t blank

MIL-STD-883F

METHOD 5008.9

18 December 2000

METHOD 5008.9

TEST PROCEDURES FOR HYBRID AND MULTICHIP MICROCIRCUITS

Method 5008 is canceled effective 1 June 1993. It is superseded by MIL-PRF-38534. For Federal Stock classes other

than 5962, the following paragraphs of MIL-PRF-38534 are provided to replace method 5008.

Superseded

method 5008

MIL-PRF-38534 Requirement

3.2 Element evaluation C.3 Element evaluation Element evaluation

3.3 Process control C.4 Process control Process control

3.4 Device screening C.5 Device screening Screening

3.5 Quality conformance evaluation C.6 Conformance

Inspection and Periodic

Inspection

QCI

MIL-STD-883F

METHOD 5008.9

18 December 2000

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MIL-STD-883F

METHOD 5009.1

25 August 1983

METHOD 5009.1

DESTRUCTIVE PHYSICAL ANALYSIS

1. PURPOSE

. The purpose of this test is to describe requirements for performance of destructive physical analysis

(DPA) for the applicable device class, for sampling, preparation, procedures, accept/reject criteria, disposition of rejected

lots and documentation. While this test method may be used by a microcircuit manufacturer, it is intended that these

procedures be actually performed by the contractor, subcontractor, or independent testing lab.

1.1 Definitions

a. Defects. Any nonconformance from specified requirements for form, fit, function, or workmanship.

b. Destructive physical analysis. The process of disassembling, testing, and inspecting a device for the purpose of

determining conformance with applicable design and process requirements.

c. Lot related defect. A defect, attributable to a variance in design or the manufacturing, test or inspection process,

that may be repetitive (e.g., mask defects, metallization thickness, bond strength insulation resistance and

separation between metallization runs, wires or wires and die edge).

d. Screenable defects. A defect for which an effective nondestructive screening test or inspection is available or can

be developed.

2. APPARATUS

. The apparatus shall consist of suitable equipment to perform each specified DPA test.

3. PROCEDURE

. The organization (contractor, subcontractor, or independent test lab) conducting the DPA test should

contact the manufacturer of the product and supply a list of test methods that are to be used during the DPA test. The

manufacturer can then advice the DPA test organization if there are any significant changes to those test methods that are

allowed as modification options within MIL-STD-883, MIL-PRF-38535 or under the manufacturer’s approved program plan.

3.1 Sample selection

. A random sample shall be selected from the inspection lot in accordance with table I, unless

otherwise specified.

TABLE I. Sample selection.

Monolithic microcircuits

Two devices or 1 percent of the

inspection lot, whichever is

greater, to a maximum of 5 total

devices, unless otherwise specified,

(see 3.1.1 and 4a).

Hybrid or multichip Two devices or 1 percent of the

microcircuits inspection lot, whichever is

greater, to a maximum of 5 total

devices, unless otherwise specified,

(see 3.1.1 and 4a).

3.1.1 Combining sample

. Where an inspection lot is comprised of more than one device type covered by a single device

specification or drawing, the sample selected shall be proportionately divided from the device types in order to assure a

representative sampling, and not less than one, of each device type in the DPA sample.