MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第643页

MIL-STD-883F METHOD 5009.1 25 August 1983 1 METHOD 5009.1 DESTRUCTIVE PHYSICAL ANALYSIS 1. PURPOSE . The purpos e of thi s tes t is to desc ribe r equirement s for perfor mance of destr ucti ve physic al analys is (DPA) …

MIL-STD-883F

METHOD 5008.9

18 December 2000

This page intentionally left blank

MIL-STD-883F

METHOD 5009.1

25 August 1983

METHOD 5009.1

DESTRUCTIVE PHYSICAL ANALYSIS

1. PURPOSE

. The purpose of this test is to describe requirements for performance of destructive physical analysis

(DPA) for the applicable device class, for sampling, preparation, procedures, accept/reject criteria, disposition of rejected

lots and documentation. While this test method may be used by a microcircuit manufacturer, it is intended that these

procedures be actually performed by the contractor, subcontractor, or independent testing lab.

1.1 Definitions

a. Defects. Any nonconformance from specified requirements for form, fit, function, or workmanship.

b. Destructive physical analysis. The process of disassembling, testing, and inspecting a device for the purpose of

determining conformance with applicable design and process requirements.

c. Lot related defect. A defect, attributable to a variance in design or the manufacturing, test or inspection process,

that may be repetitive (e.g., mask defects, metallization thickness, bond strength insulation resistance and

separation between metallization runs, wires or wires and die edge).

d. Screenable defects. A defect for which an effective nondestructive screening test or inspection is available or can

be developed.

2. APPARATUS

. The apparatus shall consist of suitable equipment to perform each specified DPA test.

3. PROCEDURE

. The organization (contractor, subcontractor, or independent test lab) conducting the DPA test should

contact the manufacturer of the product and supply a list of test methods that are to be used during the DPA test. The

manufacturer can then advice the DPA test organization if there are any significant changes to those test methods that are

allowed as modification options within MIL-STD-883, MIL-PRF-38535 or under the manufacturer’s approved program plan.

3.1 Sample selection

. A random sample shall be selected from the inspection lot in accordance with table I, unless

otherwise specified.

TABLE I. Sample selection.

Monolithic microcircuits

Two devices or 1 percent of the

inspection lot, whichever is

greater, to a maximum of 5 total

devices, unless otherwise specified,

(see 3.1.1 and 4a).

Hybrid or multichip Two devices or 1 percent of the

microcircuits inspection lot, whichever is

greater, to a maximum of 5 total

devices, unless otherwise specified,

(see 3.1.1 and 4a).

3.1.1 Combining sample

. Where an inspection lot is comprised of more than one device type covered by a single device

specification or drawing, the sample selected shall be proportionately divided from the device types in order to assure a

representative sampling, and not less than one, of each device type in the DPA sample.

MIL-STD-883F

METHOD 5009.1

25 August 1983

3.2 DPA report. A DPA report shall be prepared for each inspection lot tested and submitted to the acquiring or qualifying

activity. The report shall consist of the following:

a. DPA summary sheet.

b. DPA checklist.

c. DPA test data sheet.

d. Photographs.

e. Other data or analysis supporting findings.

3.2.1 DPA checklist

. A checklist shall be used to record all attribute data from the applicable test.

3.2.2 DPA test data sheet

. A test data sheet shall be used to record the variable data from the applicable test and any

electrical test specified.

NOTE: No provisions have been included herein for electrical testing since all devices shall have already passed the

specified electrical tests; however, electrical tests may be required for follow-up analysis of a physical discrepancy.

3.2.3 DPA summary sheet

. A summary sheet shall be used to summarize the DPA test results, analysis supporting

findings, provide other essential data and indicate disposition of lot.

3.3 General requirements

3.3.1 DPA evaluation

. The results of all tests and examinations performed on DPA sample items shall be analyzed by

qualified technical personnel to determine disposition and corrective action, as applicable, of the lot from which the samples

were taken.

3.3.2 Photographs

. Photographs shall be made at sufficient magnification and with enough views to clearly document

significant details of the parts construction. When SEM or optical microscopes are used to evaluate a device, photographs

shall be made to document discrepant or worst case features.

3.3.2.1 Photograph requirements

. A minimum of two photographs will normally be required to document baseline

characteristics of an opened part prior to performance of any destructive tests. These shall be supplemented with other

photographs as required to record observed defects or anomalies. Microscopy techniques such as color, dark field, phase

contrast, interference contrast, etc., shall be used as necessary to enhance image clarity. When SEM examination is

performed the DPA report shall include, as a minimum, view(s) of significant features of the die, a photograph of the worst

case oxide step and a photograph of the worst case metallization. Each photograph shall be labeled or otherwise identified

with the DPA report number, and, if applicable, the part number, serial number, lot date code, and the magnification (and

viewing angle for SEM photographs) used.

3.3.3 Retention of DPA reports

. The original copy of all DPA reports shall be retained by the performing organization and

a copy submitted to the acquiring or qualifying activity.

3.3.4 Sectioned samples

. When performed techniques similar to those used to prepare sectioned metallurgical and

mineralogical specimens for optical examination are generally applicable to the preparation of DPA samples. The device to

be examined is first potted in a suitable plastic (or mounting by other suitable means). It is then cut or rough ground to the

desired section plane. This is followed by fine grinding, polish and sometimes an etch to bring out the necessary detail.

Care shall be taken to ensure that damage is not introduced during any of these operations (in particular, during potting

cure, cutting, and rough grinding).