MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第664页

MIL-STD-883F METHOD 5010.4 18 June 2004 14 TABLE V. Group B tes ting . Subgroup Class leve l Test MIL-STD-883 quanti ty/( acc ept number) or sampl e size number , accept number Referenc ed paragra ph S B Method Condit io…

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MIL-STD-883F
METHOD 5010.4
18 June 2004
13
TABLE IV. Group A electrical test
. 1/
Subgroup Parameters 2
/ 3/ 4/ 5/ Quantity/
acceptance number
1
Static test at +25°C
116/0
2 Static tests at maximum rated operating temperature 116/0
3 Static tests at minimum rated operating temperature 116/0
4
Dynamic test at +25°C
116/0
5 Dynamic tests at maximum rated operating temperature 116/0
6 Dynamic tests at minimum rated operating temperature 116/0
7
Functional test at +25°C
116/0
8 Functional tests at maximum and minimum rated 116/0
operating temperatures
9
Switching tests at +25°C
116/0
10 Switching tests at maximum rated operating temperature 116/0
11 Switching tests at minimum rated operating temperature 116/0
1
/ The specific parameters to be included for tests in each subgroup shall be as specified in the applicable acquisition
document. Where no parameters have been identified in a particular subgroup or test within a subgroup, no group A
testing is required for that subgroup or test to satisfy group A requirements.
2
/ At the manufacturer's option, the applicable tests required for group A testing (see 1/) may be conducted individually
or combined into sets of tests, subgroups (as defined in table I), or sets of subgroups. However, the manufacturer
shall predesignate these groupings prior to group A testing. Unless otherwise specified, the individual tests,
subgroups, or sets of tests/subgroups may be performed in any sequence.
3
/ The sample plan (quantity and accept number) for each test, subgroup, or set of tests/subgroups as predesignated in
2
/ above, shall be 116/0.
4
/ A greater sample size may be used at the manufacturer's option; however, the accept number shall remain at zero.
When the (sub)lot size is less than the required sample size, each and every device in the (sub)lot shall be inspected
and all failed devices removed from the (sub)lot for final acceptance of that test, subgroup, or set of tests/subgroups,
as applicable.
5
/ If any device in the sample fails any parameter in the test, subgroup, or set of tests/subgroups being sampled, each
and every additional device in the (sub)lot represented by the sample shall be tested on the same test set-up for all
parameters in that test, subgroup, or set of tests/subgroups for which the sample was selected, and all failed devices
shall be removed from the (sub)lot for final acceptance of that test, subgroup, or set of tests/subgroups, as
applicable. For class level S only, if this testing results in a percent defective greater than 5 percent, the (sub)lot shall
be rejected, except that for (sub)lots previously unscreened to the tests that caused failure of this percent defective,
the (sub)lot may be accepted by resubmission and passing the failed individual tests, subgroups, or set of
tests/subgroups, as applicable, using a 116/0 sample.
MIL-STD-883F
METHOD 5010.4
18 June 2004
14
TABLE V. Group B testing.
Subgroup
Class
level
Test
MIL-STD-883 quantity/(accept
number)
or sample
size number,
accept number
Referenced
paragraph
S B
Method Condition
1
X X Physical dimensions 2016
2 (0)
2 X
Particle impact noise
detection test
2020 A or B 15 (0) 3.4.7
3 X X Resistance to solvents 2015
3 (0)
4 X X Internal visual and
mechanical
2014
1 (0) 3.4.2
5 X X Bond strength
a. Thermocompression
b. Ultrasonic or
wedge
c. Flip-chip
d. Beam lead
2011
C or D
C or D
F
H
2 (0)
6 X X Die shear strength or
substrate attach
strength
2019
or
2027
2 (0)
7 X X Solderability 2003 Solder
temperature
245°C ±5°C
1 (0)
8 X X Seal
a. Fine
b. Gross
1014
Sample size
number = 15
C = 0
3.4.8
MIL-STD-883F
METHOD 5010.4
18 June 2004
15
TABLE VI. Group C testing
.
Subgroup
Class
levels
Test MIL-STD-883 Sample size
number,
accept number
Referenced
paragraph
S B
Method Condition
1 X
X
X
X
X
X
X
X
X
X
X
X
X
External
Temperature cycling
Mechanical shock or
constant acceleration
Seal (fine and gross)
Radiographic
Visual examination
End point electrical
2009
1010
2002
2001
1014
2012
C
100 cycles
minimum
B, Y1 axis
E, Y1 axis
Y axis
In accordance
with visual
criteria of
method 1010.
As specified
in accordance
with device
specification
Sample size
number = 15
C = 0
3.4.13
3.4.5
3.4.6
3.4.8
3.4.12
3.5.2.3
2 X X Steady-state life test
End point electrical
1005 1,000 hours
at +125°C
minimum
As specified
in accordance
with device
specification
Sample size
number = 22
C = 0
3.5.2.3
TABLE VII. Group D testing
.
Subgroup
Class Test
MIL-STD-883 Quantity/
accept
number
Referenced
paragraph
S B
Method Condition
1 X X Internal water vapor
content
5000 PPM maximum water
content at +100°C
1018
3 devices
(0 failures)
or
5 devices
(1 failure)
2 X X Moisture resistance 1004
5 (0)
3 X X Salt atmosphere 1009
5 (0)