MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第680页

MIL-STD-883F METHOD 5010.4 18 June 2004 30 APPENDIX II 40.5 Test resul ts . W hen r equired by the applic able d ocument, t he foll owing tes t res ults shal l be made avai labl e for eac h lot s ubmitt ed for qual ific …

100%1 / 708
MIL-STD-883F
METHOD 5010.4
18 June 2004
29
APPENDIX II
40.3 PM evaluation
. PM structures shall be submitted for approval. Wafer acceptance will be made on a wafer by wafer
basis depending upon the information derived from PM room temperature testing in accordance with table III. If drop-in
PM's are utilized, each wafer shall have at least 5 PM's; one shall be stepped in the center and the others in each of the
quadrants. For kerf PM's and PM's on individual die, the five probed PM's shall be located in the center and in each of the
quadrants. Quadrant PM's shall lie at least two-thirds of a radius away from the wafer center. Wafer acceptance will be
governed by table III.
TABLE III. PM evaluation
.
PM type
Number within PM
specification limits
Less than 3 out of 5
Drop-in
Reject
Kerf
Reject
Each die
Reject
40.4 Lot acceptance
. Acceptance requirements are as defined in table IV.
TABLE IV. Wafer lot acceptance requirements
.
Requirement
Condition Acceptance
Line certified MIL-PRF-38535
Appendix A
Control to specification
Lot traveler check points MIL-PRF-38535
Appendix A
100 percent in specifi-
cation for lot acceptance
PM test data Every wafer 75 percent of wafers in
lot pass PM evaluation,
otherwise reject.
Visual inspection Every wafer Wafer by wafer
SEM inspection MIL-STD-883
Method 2018
Method 2018 criteria
MIL-STD-883F
METHOD 5010.4
18 June 2004
30
APPENDIX II
40.5 Test results
. When required by the applicable document, the following test results shall be made available for each
lot submitted for qualification or quality conformance.
a. Results of each test conducted; initial and any resubmission.
b. Number of wafers rejected.
c. Failure analysis data and failure mode of each rejected SEC and the associated mechanism for catastrophic
failures for each rejected device.
d. Number of reworked wafers and reason for rework.
e. Read and record data of PM electric parameter measurements.
40.6 Defective devices
. All wafers that fail any test criteria shall be removed at the time of observation or immediately at
the conclusion of the test in which the failure was observed. Once rejected and verified as a failure, no wafer may be
retested for acceptance.
MIL-STD-883F
METHOD 5011.4
31 October 1995
1
METHOD 5011.4
EVALUATION AND ACCEPTANCE PROCEDURES FOR POLYMERIC MATERIALS
1. Purpose
. This method establishes the minimum inspection procedures and acceptance criteria for polymeric materials
used in microcircuit applications. These materials shall be classified in two types as follows:
a. Type I being electrically conductive.
b. Type II being electrically insulative.
1.1 The user may elect to supplement Quality Conformance Inspection (QCI) test data or Qualification Testing data as a
substitute where applicable for user Certification Testing.
2. Apparatus
. Suitable measurement equipment necessary to determine compliance with the requirements of the
applicable acquisition document and other apparatus as required in the referenced test methods.
3. Procedures
.
3.1 Material acquisition specification
. The microcircuit manufacturer shall prepare an acquisition specification describing
the detailed electrical, mechanical, chemical, and thermal requirements for the polymeric material to be acquired. The
requirements shall not be less than those imposed by this method, but may be increased to reflect the specific parameters of
a particular material or the requirements of a particular application.
3.2 Certificate of compliance
. The material supplier shall provide upon the users request a certificate of compliance for
each polymeric material order. This certificate shall contain the actual test data for the supplier's testing as prescribed in this
document.
3.3 Evaluation procedures
. Evaluation procedures for polymeric materials shall be performed as specified in 3.4.1
through 3.5.13 for the type of material being tested.
3.4 Properties of uncured materials
.
3.4.1 Materials
. The components of a polymeric material and/or system shall be examined in accordance with table I and
3.8.1 and shall be uniform in consistency and free of lumps or foreign matter when examined in film, liquid or other
acceptable form. Any filler shall remain uniformly dispersed and suspended during the required pot life (see 3.8.3). The
electrically conductive fillers used in type I materials shall be gold, silver, alloys of gold or silver, or other precious metals.
3.4.1.1 Encapsulating compounds
Encapsulating compounds are liquidous material and are to be tested in accordance
with the requirements in Table I.
3.4.1.2 Molding compounds.
Molding compounds as used in microelectronic devices are normally solidous material and
are to be tested in accordance with MIL-PRF-38535, Appendix H Tables H-IB and H-IIB.
3.4.2 Viscosity
. The viscosity of paste materials shall be determined in accordance with 3.8.2. The viscosity, including an
acceptable range, shall be specified in the material acquisition document.
3.4.3 Pot life
. The pot life when required shall be determined in accordance with 3.8.3 and shall be a minimum of 1 hour.
The polymeric material shall be used within the pot life period after removal from the container, after mixing, or after thawing
to room temperature in the case of premixed frozen polymers.
3.4.4 Shelf life
. The shelf life, defined as the time that the polymeric material continues to meet the requirements of this
specification shall be determined in accordance with 3.8.4. This shelf life shall be a minimum of 12 months at -40°C or
below for one component system and a minimum of 12 months at room temperature (32°C maximum) for two component
systems unless the supplier certifies for some other period of time. For class K devices, no polymeric material shall be used
after the expiration date. Materials in class H devices may be requalified once, with acquiring activity and qualifying activity
approval. Encapsulants shall have a minimum shelf life of 6 months.