MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第681页

MIL-STD-883F METHOD 5011.4 31 October 1995 1 METHOD 5011.4 EVALUATION AND ACC EPTANCE PROCEDUR ES FOR POLYMERI C MATERIALS 1. Purpos e . This method est ablis hes the mi nimum inspec tion pr ocedures and accept ance cr i…

MIL-STD-883F

METHOD 5010.4

18 June 2004

APPENDIX II

40.5 Test results

. When required by the applicable document, the following test results shall be made available for each

lot submitted for qualification or quality conformance.

a. Results of each test conducted; initial and any resubmission.

b. Number of wafers rejected.

c. Failure analysis data and failure mode of each rejected SEC and the associated mechanism for catastrophic

failures for each rejected device.

d. Number of reworked wafers and reason for rework.

e. Read and record data of PM electric parameter measurements.

40.6 Defective devices

. All wafers that fail any test criteria shall be removed at the time of observation or immediately at

the conclusion of the test in which the failure was observed. Once rejected and verified as a failure, no wafer may be

retested for acceptance.

MIL-STD-883F

METHOD 5011.4

31 October 1995

METHOD 5011.4

EVALUATION AND ACCEPTANCE PROCEDURES FOR POLYMERIC MATERIALS

1. Purpose

. This method establishes the minimum inspection procedures and acceptance criteria for polymeric materials

used in microcircuit applications. These materials shall be classified in two types as follows:

a. Type I being electrically conductive.

b. Type II being electrically insulative.

1.1 The user may elect to supplement Quality Conformance Inspection (QCI) test data or Qualification Testing data as a

substitute where applicable for user Certification Testing.

2. Apparatus

. Suitable measurement equipment necessary to determine compliance with the requirements of the

applicable acquisition document and other apparatus as required in the referenced test methods.

3. Procedures

3.1 Material acquisition specification

. The microcircuit manufacturer shall prepare an acquisition specification describing

the detailed electrical, mechanical, chemical, and thermal requirements for the polymeric material to be acquired. The

requirements shall not be less than those imposed by this method, but may be increased to reflect the specific parameters of

a particular material or the requirements of a particular application.

3.2 Certificate of compliance

. The material supplier shall provide upon the users request a certificate of compliance for

each polymeric material order. This certificate shall contain the actual test data for the supplier's testing as prescribed in this

document.

3.3 Evaluation procedures

. Evaluation procedures for polymeric materials shall be performed as specified in 3.4.1

through 3.5.13 for the type of material being tested.

3.4 Properties of uncured materials

3.4.1 Materials

. The components of a polymeric material and/or system shall be examined in accordance with table I and

3.8.1 and shall be uniform in consistency and free of lumps or foreign matter when examined in film, liquid or other

acceptable form. Any filler shall remain uniformly dispersed and suspended during the required pot life (see 3.8.3). The

electrically conductive fillers used in type I materials shall be gold, silver, alloys of gold or silver, or other precious metals.

3.4.1.1 Encapsulating compounds

Encapsulating compounds are liquidous material and are to be tested in accordance

with the requirements in Table I.

3.4.1.2 Molding compounds.

Molding compounds as used in microelectronic devices are normally solidous material and

are to be tested in accordance with MIL-PRF-38535, Appendix H Tables H-IB and H-IIB.

3.4.2 Viscosity

. The viscosity of paste materials shall be determined in accordance with 3.8.2. The viscosity, including an

acceptable range, shall be specified in the material acquisition document.

3.4.3 Pot life

. The pot life when required shall be determined in accordance with 3.8.3 and shall be a minimum of 1 hour.

The polymeric material shall be used within the pot life period after removal from the container, after mixing, or after thawing

to room temperature in the case of premixed frozen polymers.

3.4.4 Shelf life

. The shelf life, defined as the time that the polymeric material continues to meet the requirements of this

specification shall be determined in accordance with 3.8.4. This shelf life shall be a minimum of 12 months at -40°C or

below for one component system and a minimum of 12 months at room temperature (32°C maximum) for two component

systems unless the supplier certifies for some other period of time. For class K devices, no polymeric material shall be used

after the expiration date. Materials in class H devices may be requalified once, with acquiring activity and qualifying activity

approval. Encapsulants shall have a minimum shelf life of 6 months.

MIL-STD-883F

METHOD 5011.4

31 October 1995

TABLE I. Requirements

Test or Condition Test Adhesives α Absorbers Film Dielectrics 1

Particle Getters

Method Supplier

User Supplier

User

Paragraph

A C A C A C A C A C A C A C A C

Materials (3.4.1) 3.8.1 X X X X X X X X X X X X X X X X

Viscosity (3.4.2) 3.8.2 X X X X X X

Pot Life (3.4.3) 3.8.3 X X X X X X

Shelf Life (3.4.4) 3.8.4 X X X X

Thermogravimetric analysis (3.5.2) 3.8.5 X X X X X X X

Outgassed materials (3.5.3) 3.8.6 X X X X

Ionic impurities(3.5.4) 3.8.7 X X X X X X

Bond strength (3.5.5) 3.8.8 X 2/

X X

Coefficient of linear thermal

expansion (3.5.6)

3.8.9 X

Thermal conductivity (3.5.7) 3.8.10 X

Volume resistivity (3.5.8) 3.8.11 X

Type 1 materials X 2/

Type 2 materials X X X X X

Dielectric constant (3.5.9) 3.8.12 X X

Dissipation factor (3.5.10) 3.8.13 X X

Sequential test environment (3.5.11) 3.8.14 X X X

Density (3.5.12) 3.8.15

Mechanical integrity (3.5.13) 3.8.16 X

Operating life test (3.5.14) 3.8.17 X

A= Performed at acceptance testing.

C= Performed at certification testing.

/ Film dielectrics are defined as polymeric materials that are used in film form to act as either interlayer dielectrics,

passivation layers, and/or circuit support films.

/ Required at 25

C test condition only. No high temperature storage required.