MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第80页
MIL-STD-883F METHOD 1013 1 May 1968 2 This page i ntenti onally lef t blank
MIL-STD-883F
METHOD 1013
1 May 1968
1
METHOD 1013
DEW POINT
1. PURPOSE
. The purpose of this test is to detect the presence of moisture trapped inside the microelectronic device
package in sufficient quantity to adversely affect device parameters. The most sensitive indicator of moisture is device
leakage current. This test specifies a lower temperature of -65°C for the normal dew point test. It may be desirable in some
cases, where the presence of moisture in concentrations lower than that would be revealed at this lower temperature, to
extend the lower temperature downward.
2. APPARATUS
. The apparatus used in this test shall be capable of varying the temperature from the specified high
temperature to -65°C while the parameter is being measured.
3. PROCEDURE
. The voltage and current specified in the applicable acquisition document shall be applied to the
terminals and the device leakage current or other specified parameter(s) continuously monitored from the specified high
temperature to -65°C and back to the high temperature. The dew point temperature is indicated by a sharp discontinuity in
the parameter being measured with respect to temperature. If no discontinuity is observed, it shall be assumed that the dew
point is at a temperature lower than -65°C and the device being tested is acceptable. Devices which demonstrate instability
of the measured parameter at any point during this test shall be rejected even though a true dew point is not identified. If a
high temperature is not specified in the applicable acquisition document, the device shall be taken to a temperature at least
10°C above ambient temperature to initiate this test and enable detection of dew point in devices which may already be at
saturation. The rate of change of temperature for this test shall be no greater than 10°C per minute. The test voltage shall
be at least equal to the rated breakdown voltage of the device since it is necessary to apply sufficient voltage to achieve
ionization.
4. SUMMARY
. The following details shall be specified on the applicable acquisition document:
a. Test temperature, high (see 3) and low if other than -65°C (see 1).
b. Test voltage and current (see 3).
c. Test parameter (see 1 and 3).
MIL-STD-883F
METHOD 1013
1 May 1968
2
This page intentionally left blank
MIL-STD-883F
METHOD 1014.11
18 June 2004
1
METHOD 1014.11
SEAL
1. PURPOSE
. The purpose of this test is to determine the effectiveness (hermeticity) of the seal of microelectronic and
semiconductor devices with designed internal cavities.
1.1 Definitions
.
a. Standard leak rate. Standard leak rate is defined as that quantity of dry air at 25°C in atmosphere cubic
centimeters flowing through a leak or multiple leak paths per second when the high-pressure side is at 1
atmosphere (760 mm Hg absolute) and the low-pressure side is at a pressure of not greater than 1 mm Hg
absolute. Standard leak rate shall be expressed in units of atmosphere cubic centimeters per second (atm cc/s).
b. Measured leak rate. Measured leak rate (R
1
) is defined as the leak rate of a given package as measured under
specified conditions and employing a specified test medium. Measured leak rate shall be expressed in units of
atmosphere cubic centimeters per second (atm cc/s). For the purpose of comparison with rates determined by
other methods of testing, the measured leak rates must be converted to equivalent standard leak rates.
c. Equivalent standard leak rate. The equivalent standard leak (L) of a given package, with a measured leak rate
(R
1
), is defined as the leak rate of the same package with the same leak geometry, that would exist under the
standard conditions of 1.1a. The formula (does not apply to test condition B) in 3.1.1.2 represents the L/R ratio
and gives the equivalent standard leak rate (L) of the package with a measured leak rate (R
1
) where the package
volume and leak test conditioning parameters influence the measured value of (R
1
). The equivalent standard leak
rate shall be expressed in units of atmosphere cubic centimeters per second (atm cc/s).
2. APPARATUS
. The apparatus required for the seal test shall be as follows for the applicable test condition:
2.1 Test conditions A
1
, A
2
, and A
4
, 1/ tracer gas helium (He) fine leak. Apparatus required shall consist of suitable
pressure and vacuum chambers and a mass spectrometer-type leak detector preset and properly calibrated for a helium
leak rate sensitivity sufficient to read measured helium leak rates of 10
-9
atm cc/s and greater. The volume of the chamber
used for leak rate measurement should be held to the minimum practical, since this chamber volume has an adverse effect
on sensitivity limits. The leak detector indicator shall be calibrated using a diffusion-type calibrated standard leak at least
once during every working shift. In addition for test condition A
4
, the following apparatus is required:
a. Fixture and fittings to mate the package to be tested to the leak detector.
b. Surgical rubber gasket.
c. Apeizon grease (type M or N), perfluorocarbon fluid 2
/, or equivalent, if required to obtain seal.
1
/ A
3
was intentionally omitted.
2
/ Perfluorocarbons contain no chlorine or hydrogen.
*