MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第9页

MIL-STD-883F 3 2. APPLICABLE DOCUMENTS 2.1 General . The document s li sted i n this sect ion are s pecif ied in s ecti ons 3, 4, and 5 of thi s st andard. Thi s s ecti on does not inc lude document s ci ted in ot her se…

MIL-STD-883F

1.2.1 Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices

. When any manufacturer,

contractor, subcontractor, or original equipment manufacturer requires or claims a non-JAN part compliant with

MIL-STD-883, all provisions of Appendix A of MIL-PRF-38535 shall be met. In addition, manufacturers that have produced

or are producing products in accordance with 1.2.1a are subject to a Government compliance validation audit on a drop-in

basis with a minimum of notice. Such processing and testing shall be in compliance with all of the applicable general

controls and requirements defined herein and those of the specifically referenced test methods and procedures with no

reinterpretations, deviations or omissions except as specifically allowed in the device specification or standard microcircuit

drawing covering the same generic device. Deviations specifically granted in the device specification or standard

microcircuit drawing may also be applied to devices manufactured in the same process, to the same design criteria, and

using elements of the same microcircuit group as those used for devices covered by the device specification or standard

microcircuit drawing. Such reference include the following:

Manufacturers who use MIL-STD-883 in device marking, or make statements in applicable certificates of

conformance that parts are compliant with MIL-STD-883, or make statements in advertisements or in published

brochures or other marketing documents that parts provided are compliant with MIL-STD-883.

Contractors, sub-contractors, or original equipment manufacturers who prepare vendor item drawings,

(previously called Specification Control drawings), or Selected Item drawings which require compliance with

MIL-STD-883, or invoke it in its entirety as the applicable standard (see 1.2.2 for noncompliant devices).

a. Custom monolithic, non-JAN multichip and all other non-JAN microcircuits except non-JAN hybrids described or

implied to be compliant with methods 5004 and 5005 or 5010 of MIL-STD-883 shall meet all of the non-JAN

requirements of Appendix A of MIL-PRF-38535.

b. Hybrid microcircuits described as compliant or multichip microcircuits described as compliant to MIL-PRF-38534

shall meet all the requirements of MIL-PRF-38534 (or equivalent procedures/ requirements of reciprocal listing

provisions for product of other nations based on existing international agreements):

1.2.2 Provisions for the use of MIL-STD-883 in conjunction with non-compliant non -JAN devices

. Any device that is

processed with deviations and which is not processed in compliance with the provisions of 1.2.1 defined herein shall not be

claimed to be compliant and shall not be marked "/883", "/883B", "/883S", or any variant thereof. All applicable

documentation (including device specifications or manufacturer's data sheets and responses to RFQ's invoking

MIL-STD-883) shall clearly and specifically define any and all areas of nonconformance and identify them as deviations in

language that is not subject to misinterpretation by the acquiring authority.

If the contract or order specifically requires compliance with, equivalence to, or a product that is equal to or better than

MIL-STD-883 class B or class S, any exceptions taken to the requirements of the referenced quality level (i.e., 1.2.1 above)

shall prohibit the manufacturer from claiming or implying equivalence to that level.

Specific reference to one or more MIL-STD-883 method(s) on a stand-alone basis requires compliance to only the

specifically referenced method(s). Such devices are not considered compliant in accordance with 1.2.1 above. However,

compliance with only the test procedures contained in test methods 5004, 5005, and 5010 on a stand-alone basis (without

specifying compliance or noncompliance to 1.2.1) does not satisfy the requirement for form, fit, and function defined in MIL-

PRF-38535 for configuration items, and any reference to these methods on a stand alone basis requires compliance to all

the provisions of 1.2.1.

MIL-STD-883F

2. APPLICABLE DOCUMENTS

2.1 General

. The documents listed in this section are specified in sections 3, 4, and 5 of this standard. This section does

not include documents cited in other sections of this standard or recommended for additional information or as examples.

While every effort has been made to ensure the completeness of this list, document users are cautioned that they must

meet all specified requirements documents cited in sections 3, 4, and 5 of this standard, whether or not they are listed.

2.2 Government documents

2.2.1 Specifications, standards, and handbooks

. The following specifications, standards, and handbooks form a part of

this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in

the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-PRF-19500 - Semiconductor Devices, General Specification For.

MIL-PRF-38534 - Hybrid Microcircuits, General Specification For.

MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification For.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-1835 - Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-217 - Reliability Prediction of Electronic Equipment.

MIL-HDBK-505 - Definitions of Item Levels, Item Exchangeability, Models, and Related Terms.

(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/

or www.dodssp.daps.mil or

from the Standardization Documents Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

MIL-STD-883F

2.3 Non-Government publications

. The following documents form a part of this document to the extent specified herein.

Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

INTERNATIONAL ORGANIZATION FOR STANDARDIZATION (ISO) STANDARDS

ISO 14644-1 - Cleanrooms and Associated Controlled Environments – Part 1: Classification of Air

Cleanliness.

ISO 14644-2 - Cleanrooms and Associated Controlled Environments – Part 2: Specifications for

Testing and Monitoring to Prove Confinued Compliance with ISO 14644-1.

(Copies of these documents are available online at http://iest.org

or from the Institute of Environmental Sciences and

Technology (IEST), 940 East Northwest Highway, Mount Prospect, IL 60056-3444.)

INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS

ANSI/IUPC-T-50 - Terms and Definitions.

(Copies of these documents are available online at http://ipc.org

or from the Institute for Interconnecting and Packaging

Electronic Circuits, 7380 N. Lincoln Avenue, Lincolnwood, IL 60616.)

AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI)

ANSI/NCSL Z540-1 - Calibration Laboratories and Measuring and Test Equipment,

General Requirements

ANSI/J-STD-004 - Requirements for Soldering Fluxes

ANSI/J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid

Solders for Electronic Soldering Applications

(Copies of these documents are available online at http://ansi.org

or from to the American National Standards

International, 25 West 43

Street, 4

Floor, New York, NY 10036)

ELECTRONICS INDUSTRIES ALLIANCE

IPC/EIA/JEDEC J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires.

EIA/JESD78 IC Latch-up Test.

EIA-557-A Statistical Process Control Systems.

(Copies of these documents are available online at http://www.eia.org

or from the Electronic Industries Alliance, 2500

Wilson Boulevard, Arlington, VA 22201-3834; or to IPC, 2215 Sanders Road, Northbrook, IL 60062-6135.)

AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)

ASTM E 263 - Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation

of Iron.

ASTM E 264 - Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation

of Nickel.

ASTM E 265 - Standard Test Method for Measuring Reaction Rates and Fast-Neutron Fluences by

Radioactivation of Sulfur-32.

ASTM E 526 - Standard Method for Measuring Dose for Use in Linear Accelerator Pulsed Radiation

Effects Tests.

ASTM E 666 - Standard Practice for Calculating Absorbed Dose from Gamma or X-Radiation.

ASTM E 668 - Standard Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for

Determining Absorbed Dose on Radiation-Hardess Testing of Electronic Devices.

ASTM E 720 - Standard Guide for Selection and Use of Neutron Sensors for Determining Neutron

Spectra Employed in Radiation-Hardness Testing of Electronics.

ASTM E 721 - Standard Method for Determining Neutron Energy Spectra with Neutron-Activation Foils

for Radiation-Hardness Testing of Electronics.