00197902-03_UM_X-Serie-S_EN - 第152页

3 Technical data and assemblies User manual SIPLACE X-Series 3.5 Placement head From software version 710.0 Edition 12/2016 152 3.5.6.9 T echnical dat a for SIPLACE MultiSt ar (CPP) 3 SIPLACE MultiStar (CPP) with compone…

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User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 710.0 Edition 12/2016 3.5 Placement head
151
3.5.6.8 MultiStar in advanced Pick&Place mode with limited rotation
The MultiStar can place the entire component spectrum from 01005 to 50 mm x 40 mm in this
mode. The large components are picked up last, optically centered and then placed as first com-
ponents.
3
Fig. 3.5 - 12 MultiStar - mixed mode
K_BE Small component (see table 3.5 - 1, page 147)
M_BE_2 Medium sized component, type 2 (see table 3.5 - 1
, page 147)
G_BE Large component (see table 3.5 - 1
, page 147)
Type 30 Component camera, type 30
Type 33 Stationary component camera, type 33
1 ... 8 Order of components taken up
3
Neighboring segments of the CPP head are not able to take up components of types M_BE_2 and
G_BE if the diagonal length of these components is longer than 39.8 mm.
Type 30
K_BE
G_BE
Type 33
M_BE_2
3 Technical data and assemblies User manual SIPLACE X-Series
3.5 Placement head From software version 710.0 Edition 12/2016
152
3.5.6.9 Technical data for SIPLACE MultiStar (CPP)
3
SIPLACE MultiStar (CPP)
with component camera
type 30
With component camera
type 45
*a
With component camera
type 33
(stationary camera)
Component range
*b
01005 mm to 27 mm x
27 mm
0201 (metric) to
15 mm x 15 mm
0402 to 50 mm x 40 mm
*c
Component spec.
Max height
*d
Max. height
*e
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
6.0 mm
8.5 mm
0.25 mm
0.10 mm
*f
/ 0.2 mm
*g
0.25 mm
f
/ 0.35 mm
g
0.14 mm
f
/ 0.20 mm
g
0.4mm x 0.2mm
27 mm x 27 mm
4 g
6.0 mm
8.5 mm
0.25 mm / 0.12 mm
*h
0.10 mm / 0.05 mm
h
0.25 mm
*i
/ 0.14 mm
h
0.14 mm
i
/ 0.07 mm
h
0.18 mm x 0.18 mm
0.11 mm x 0.11 mm
g
15 mm x 15 mm
4 g
11.5 mm
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0 mm x 0.5 mm
50 mm x 40 mm
8 g
Programmable set-down force 1.0 - 10 N 1.0 - 10 N 1.0 - 10 N
Nozzle types 20xx, 28xx 20xx, 28xx 20xx, 28xx
X/Y accuracy
*j
± 41 µm/3σ
± 55 µm/4σ
± 41 µm/3σ
± 55 µm/4σ
± 34 µm/3σ
± 45 µm/4σ
Angular accuracy
± 0.4° / 3σ
*k
, ± 0.5° /
3σ
*l
± 0.5° / 4σ
k
, ± 0.7° / 4σ
l
± 0.4° / 3σ
k
, ± 0.5° / 3σ
l
± 0.5° / 4σ
k
, ± 0.7° / 4σ
l
± 0.2° / 3σ
± 0.3° / 4σ
Illumination level 5 5 6
Possible illumination level settings 256
5
256
5
256
6
*)a For SIPLACE X4 S micron / X4i S micron only
*)b Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the
component packaging tolerances and the component tolerances.
*)c A diagonal of 69 mm is possible during multiple measurements (e.g. 60 mm x 10 mm).
*)d CPP head: in low installation position (stationary component camera not possible).
*)e CPP head: in high installation position
*)f For components < 18 mm x 18 mm
*)g For components ≥ 18 mm x18 mm
*)h Only possible for components which are within the camera focal area of ± 1.3 mm.
*)i For components < 18 mm x 18 mm
*)j The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the conditions set out
in the SIPLACE scope of service and supply.
*)k Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.
*)l Component dimensions smaller than 6 mm x 6 mm.
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 710.0 Edition 12/2016 3.5 Placement head
153
3.5.7 SIPLACE TwinStar for high precision IC placement
3
Fig. 3.5 - 13 SIPLACE TwinStar for high precision IC placement
3
(1) Pick&Place module 1 (P&P1) - the TwinStar consists of 2 Pick&Place modules
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis