00197902-03_UM_X-Serie-S_EN - 第153页

User manual SIPLACE X-Series 3 Technical data and assemblies From software version 710.0 Edition 12/2016 3.5 Placement head 153 3.5.7 SIPLACE T winSt ar for high precision IC placement 3 Fig. 3.5 - 13 SIPLACE T winSt ar …

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3 Technical data and assemblies User manual SIPLACE X-Series
3.5 Placement head From software version 710.0 Edition 12/2016
152
3.5.6.9 Technical data for SIPLACE MultiStar (CPP)
3
SIPLACE MultiStar (CPP)
with component camera
type 30
With component camera
type 45
*a
With component camera
type 33
(stationary camera)
Component range
*b
01005 mm to 27 mm x
27 mm
0201 (metric) to
15 mm x 15 mm
0402 to 50 mm x 40 mm
*c
Component spec.
Max height
*d
Max. height
*e
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
6.0 mm
8.5 mm
0.25 mm
0.10 mm
*f
/ 0.2 mm
*g
0.25 mm
f
/ 0.35 mm
g
0.14 mm
f
/ 0.20 mm
g
0.4mm x 0.2mm
27 mm x 27 mm
4 g
6.0 mm
8.5 mm
0.25 mm / 0.12 mm
*h
0.10 mm / 0.05 mm
h
0.25 mm
*i
/ 0.14 mm
h
0.14 mm
i
/ 0.07 mm
h
0.18 mm x 0.18 mm
0.11 mm x 0.11 mm
g
15 mm x 15 mm
4 g
11.5 mm
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0 mm x 0.5 mm
50 mm x 40 mm
8 g
Programmable set-down force 1.0 - 10 N 1.0 - 10 N 1.0 - 10 N
Nozzle types 20xx, 28xx 20xx, 28xx 20xx, 28xx
X/Y accuracy
*j
± 41 µm/3σ
± 55 µm/4σ
± 41 µm/3σ
± 55 µm/4σ
± 34 µm/3σ
± 45 µm/4σ
Angular accuracy
± 0.4° / 3σ
*k
, ± 0.5° /
3σ
*l
± 0.5° / 4σ
k
, ± 0.7° / 4σ
l
± 0.4° / 3σ
k
, ± 0.5° / 3σ
l
± 0.5° / 4σ
k
, ± 0.7° / 4σ
l
± 0.2° / 3σ
± 0.3° / 4σ
Illumination level 5 5 6
Possible illumination level settings 256
5
256
5
256
6
*)a For SIPLACE X4 S micron / X4i S micron only
*)b Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the
component packaging tolerances and the component tolerances.
*)c A diagonal of 69 mm is possible during multiple measurements (e.g. 60 mm x 10 mm).
*)d CPP head: in low installation position (stationary component camera not possible).
*)e CPP head: in high installation position
*)f For components < 18 mm x 18 mm
*)g For components ≥ 18 mm x18 mm
*)h Only possible for components which are within the camera focal area of ± 1.3 mm.
*)i For components < 18 mm x 18 mm
*)j The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the conditions set out
in the SIPLACE scope of service and supply.
*)k Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.
*)l Component dimensions smaller than 6 mm x 6 mm.
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 710.0 Edition 12/2016 3.5 Placement head
153
3.5.7 SIPLACE TwinStar for high precision IC placement
3
Fig. 3.5 - 13 SIPLACE TwinStar for high precision IC placement
3
(1) Pick&Place module 1 (P&P1) - the TwinStar consists of 2 Pick&Place modules
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis
3 Technical data and assemblies User manual SIPLACE X-Series
3.5 Placement head From software version 710.0 Edition 12/2016
154
3.5.7.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether. Both heads work using the Pick&Place principle. The TwinStar is suitable for processing
complex and large components. Two components are picked up by the placement head, optically
centered on the way to the placement position and rotated into the necessary placement angle.
They are then placed gently and accurately onto the PCB with a controlled blast of air.
New nozzles (type 5xx) have been developed for the TwinStar. With an adapter you can also use
the nozzles of type 4xx from the Pick&Place head and nozzles of type 8xx and 9xx from the Col-
lect&Place heads.