00197902-03_UM_X-Serie-S_EN - 第156页

3 Technical data and assemblies User manual SIPLACE X-Series 3.6 Gantry system From software version 710.0 Edition 12/2016 156 3.6 Gantry system 3.6.1 Position of gantries in SIPLACE X4i S / X4i S micron 3 Fig. 3.6 - 1 P…

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User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 710.0 Edition 12/2016 3.5 Placement head
155
3.5.7.2 Technical data Twin Star
SIPLACE TwinStar
with component camera type 33
(fine pitch camera)
with component camera type 25
(flip chip camera)
Component range
*a
0402 to SO, PLCC, QFP, BGA, special
components, bare dies, flip-chips
0201 to SO, PLCC, QFP, sockets, plugs, BGA,
special components, bare dies, flip-chips,
shields
Component specs
*b
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*c
25 mm
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0mm x 0.5mm
55 mm x 45 mm (single measurement)
For use with two nozzles (multiple mea-
surement)
50 mm x 50 mm or
69 mm x 10 mm
For use with one nozzle
85 mm x 85 mm or
125 mm x 10 mm
up to 200 mm x 125 mm (with restric-
tions)
100 g
25 mm
0.25 mm
0.1 mm
0.14 mm
0.08 mm
0.6 mm x 0.3 mm
16 mm x 16 mm (single measurement)
55 mm x 55 mm (multiple measurement)
100 g
Programmable set-down
force
1.0 N - 15 N
2.0 N - 30 N
*d
1.0 N - 15 N
2.0 N - 30 N
d
Nozzle types
*e
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
gripper
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
gripper
Nozzle spacing for P&P
heads
70.8 mm 70.8 mm
X/Y accuracy
*f
± 26 µm / 3σ, ± 35 µm / 4σ ± 22 µm / 3σ, ± 30 µm / 4σ
Angular accuracy ± 0.05° / 3σ, ± 0.07°/ 4σ ± 0.05° / 3σ, ± 0.07° / 4σ
Illumination level 6 6
Possible illumination level
settings
256
6
256
6
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the
component packaging tolerances and the component tolerances.
*)b If the MultiStar and TwinStar are combined in the same placement area, the maximum component height may be restricted .
*)c If standard nozzles are used
*)d SIPLACE High-Force Head.
*)e Over 300 different nozzles and 100 gripper types are available, with an extensive nozzle database available online.
*)f The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the conditions set out in
the SIPLACE scope of service and supply.
3 Technical data and assemblies User manual SIPLACE X-Series
3.6 Gantry system From software version 710.0 Edition 12/2016
156
3.6 Gantry system
3.6.1 Position of gantries in SIPLACE X4i S / X4i S micron
3
Fig. 3.6 - 1 Position of gantries - SIPLACE X4i S / X4i S micron
(1) Y axis, gantry 1 and gantry 4
(2) X axis, gantry 1
(3) X axis, gantry 2
(4) Y axis, gantry 3 and gantry 4 (concealed)
(5) X axis, gantry 3
(6) X axis, gantry 4
(T) Direction of PCB transport
(1)
(3)
(6)
(4)
(2)
(5)
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 710.0 Edition 12/2016 3.6 Gantry system
157
3.6.2 Position of gantries in SIPLACE X4 S / X4 S micron
3
Fig. 3.6 - 2 Position of gantries in SIPLACE X4 S / X4 S micron
(1) Y axis, gantry 1 and gantry 4
(2) X axis, gantry 1
(3) X axis, gantry 2
(4) Y axis, gantry 3 and gantry 4 (concealed)
(5) X axis, gantry 3
(6) X axis, gantry 4
(T) Direction of PCB transport
(1)
(3)
(6)
(4)
(2)
(5)