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3 Technical data and assemblies User manual SIPLACE X-Series 3.7 PCB conveyor system From software version 710.0 Edition 12/2016 170 3.7.5 Definition of PCB warp age 3.7.5.1 PCB warp age on the conveyor PCB warpage acros…

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User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 710.0 Edition 12/2016 3.7 PCB conveyor system
169
3.7.3.4 Synchronous transport mode
In synchronous mode, two PCBs of the same size are transported into the placement position at
the same time. They are processed as a common panel. When using products with greatly differ-
ing placement content, common optimization increases the performance of the whole content on
both boards.
The time needed to transport the board is reduced as two boards are always transported at the
same time. It also ensures better utilization of the nozzle configuration.
PCBs on conveyor tracks 1 and 2 are moved synchronously onto the conveyor sections (i.e. the
conveyors are controlled synchronously, but independently of one another). The components to
be placed on conveyor tracks 1 and 2 must be organized into a panel via two subpanels.
If only one conveyor lane is occupied at the beginning of placement, this single use of the con-
veyor lane will be identified as "not to be placed".
If the dual conveyor is operated in synchronous mode, the ‘PCB whispering down the line’ option
is deactivated. The "Global bad fiducial" option cannot be used.
3.7.3.5 I-Placement
In addition to synchronous and asynchronous conveyor mode, a new placement concept has
been developed for the SIPLACE X-Series: I-Placement. In this mode, the two heads work simul-
taneously and populate a PCB totally independently of one another. This further increases the out-
put.
3.7.4 Controlling and width adjustment
3.7.4.1 Controlling using the Single Functions menu
The online help contains information on controlling the PCB conveyor system and on the Single
Functions menu.
3.7.4.2 Automatic width adjustment
When the command is received, the conveyor belts are set to the desired width. Different widths
are possible for a dual conveyor.
See the Online Help for detailed information about changing the conveyor track width.
3 Technical data and assemblies User manual SIPLACE X-Series
3.7 PCB conveyor system From software version 710.0 Edition 12/2016
170
3.7.5 Definition of PCB warpage
3.7.5.1 PCB warpage on the conveyor
PCB warpage across the direction of travel max. 1 % of the PCB diagonal, but not exceeding 2 mm
3
PCB warpage in the direction of transport + PCB thickness < 5.5 mm. Bending up of board edge
max. 2.5 mm.
3
3
Fixed clamped edge
Movable clamping device
Printed circuit board
Conveyor side wall
Fixed clamped edge
Conveyor belt
PCB transport direction
Front board edge
Front board edge
Right conveyor belt
Left conveyor belt
PCB transport direction
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 710.0 Edition 12/2016 3.7 PCB conveyor system
171
3.7.5.2 PCB warpage during placement
A warpage of 2 mm can lead to problems focussing on local fiducials and ink spots in the middle
of the PCB. The digital camera's focus is 2 mm. When all the tolerances are taken into account,
this value is reduced to 1.5 mm. Also note that the component height is reduced by the warpage.
3
3
PCB warpage down, max. 0.5 mm
3
Use magnetic pin supports to achieve this value.
Movable clamping device
Fixed clamped edge
Printed circuit board
Conveyor side wall
Printed circuit board
Magnetic pin
support
Movable clamping device
Fixed clamped edge
Conveyor side wall
0.5 mm