00197902-03_UM_X-Serie-S_EN - 第22页

1 Introduction User manual SIPLACE X-Series 1.1 Machine overview From software version 710.0 Edition 12/2016 22 1.1.3 SIPLACE X4i S micron 1 Fig. 1.1 - 3 SIPLACE X4i S micron placement machine The SIPLACE X4i S micron pl…

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User manual SIPLACE X-Series 1 Introduction
From software version 710.0 Edition 12/2016 1.1 Machine overview
21
Three placement methods are possible for processing the components:
– Collect&Place,
– Pick&Place and
– A combination of Collect&Place and Pick&Place (mixed mode).
The SIPLACE X4 S placement machine has four gantries. The two gantries in placement area 1
point to location 4. The two gantries in placement area 2 point to location 2.
These can be quickly and accurately positioned by linear motors, moving independently of one
another in the X and Y directions.
The SIPLACE X4 S placement machine has two placement areas, one single conveyor or one
dual conveyor. Two boards can be placed at the same time on dual conveyors.
There are four locations available for supplying components. These can be fitted with component
trolleys and configured with up to 40 tracks.
1.1.2.1 Overview of placement head configuration
1
CPP_H = Multistar CPP in high assembly position
CPP_L = Multistar CPP in low assembly position
Placement area 1 Placement area 2
C&P20 / C&P 20 C&P20 / C&P 20
C&P20 / C&P 20 CPP_L/CPP_L
C&P20 / C&P 20 CPP_H / CPP_H
CPP_L/CPP_L CPP_L/CPP_L
CPP_L/CPP_L CPP_H / CPP_H
CPP_H / CPP_H CPP_H / CPP_H
C&P20 / C&P 20 CPP_H/TH
CPP_L/CPP_L CPP_H/TH
CPP_H / CPP_H CPP_H/TH
C&P20 / C&P 20 TH / TH
CPP_L/CPP_L TH / TH
CPP_H / CPP_H TH / TH
CPP_H/TH TH / TH
TH / TH TH / TH
1 Introduction User manual SIPLACE X-Series
1.1 Machine overview From software version 710.0 Edition 12/2016
22
1.1.3 SIPLACE X4i S micron
1
Fig. 1.1 - 3 SIPLACE X4i S micron placement machine
The SIPLACE X4i S micron placement machine is distinguished by
– Enhanced precision due to high-resolution scales
– Top performance optimization due to precision-optimized axis parameters
– Intelligent configuration strategies,
– Highest possible placement performance up to high-end processing
User manual SIPLACE X-Series 1 Introduction
From software version 710.0 Edition 12/2016 1.1 Machine overview
23
Three placement methods are possible for processing the components:
– Collect&Place,
– Pick&Place and
– A combination of Collect&Place and Pick&Place (mixed mode).
The SIPLACE X4i S micron placement machine has four gantries. The two gantries in placement
area 1 and the two gantries in placement area 2 point inwards.
These can be quickly and accurately positioned by linear motors, moving independently of one
another in the X and Y directions. The enhanced precision is realized through the use of high-res-
olution scales and in connection with optimized axis parameters. The scanning units have been
further enhanced to meet these requirements.
The SIPLACE X4i S micron placement machine has two placement areas, one single conveyor
or one dual conveyor. Two boards can be placed at the same time on dual conveyors.
There are four locations available for supplying components. These can be fitted with component
trolleys and configured with up to 40 tracks.
1.1.3.1 Overview of placement head configuration
1
1.1.3.2 Overview of placement head configuration (from SC 707.1)
1
Placement area 1 Placement area 2
C&P20 M / C&P20 M C&P20 M / C&P20 M
Placement area 1 Placement area 2
C&P20 M / C&P20 M C&P20 M / C&P20 M
C&P20 M / C&P20 M CPP / CPP