17-2756-ASM Broschüre ASM AP EN_171020 - 第10页

Die Attach & SMT Deposition 1 2 Printing Stencil technology T ruly unique: SIPLACE CA combines bare-chip and SMT placement Do you combine bare-die placement with the placement of classic SMT components in your produc…

TRS Tooling

TRS tooling

Flux printing

Die Attach & SMT Encapsulation Singulation

WLP Inspection,

Text & Packing

Flux and solder paste

With the rst two printing processes,

ux or solder paste are applied to the

substrates via classic stencil printing

with multi-level DEK e-form stencils.

The versatile DEK printer software ma-

kes it easy to adjust all relevant opera-

ting parameters.

Ball drop

For the ball drop process, i.e. the appli-

cation of solder balls onto the underside

of the SiPs, the DEK Galaxy provides

another solution. With its DirEKt Ball

Placement Option, solder balls can be

applied individually (ball attachment).

DEK Galaxy

Reliable printing in chip assembly

▪ For demanding wafer, substrate and circuit board

applications

▪ Process Alignment Capability: 2 Cpk @ ±12.5 µm 6 sigma

▪ ProFlow

DirEKt Imaging technologies for high-precision

ball placements

▪ Modular: Flexibly configurable with toolings and transport

systems for the widest range of advanced packaging

applications

▪ SMEMA- and HERMES-compatible interfaces to wafer

and flux solutions

▪ Fast: Core cycle time of only 7 seconds

▪ Flexible: Product changeovers take less than 2 minutes

▪ Easy to use: DEK Instinctiv™ software

Die Attach & SMTDeposition

PrintingStencil technology

Truly unique:

SIPLACE CA combines bare-chip and SMT placement

Do you combine bare-die placement with

the placement of classic SMT components

in your production? Or in other words: are

you looking for a universal machine that

you can use to populate large carriers in

panel level packaging as well as for clas-

sic SMT placement applications? These

processes used to be strictly separate –

until now.

Today, ASM is the  rst equipment maker

that can offer you more: the SIPLACE CA.

This uniquely innovative solution tears

down the borders between semiconduc-

tor backend and SMT handling. For the

 rst time you can run both processes on

a single machine – even simultaneously.

This improves your ef ciency, makes your

processes more stable by reducing the

number of required process steps, and

gives you a leg up on the competition.

High Precision Chip Placement

Populated 300 mm (12-inch) carrier for the wafer level fan out process

Die Attach & SMT

Encapsulation Singulation

WLP Inspection,

Text & Packing

Flexible wafer modules enable you to feed

the SIPLACE CA in Die Attach and Flip

Chip process directly from the wafer and

transfer them to panels with exceptional

speed and precision. And thanks to its  e-

xible conveyor, you can process substrate-

swith sizes of up to 650 mm × 700 mm.

These features are not the only strengths

of the SIPLACE CA. It also handles the

whole spectrum of classic SMT compon-

ents via tapes and feeders and does it all

with breathtaking speed. With its four SIP-

LACE SpeedStar heads, the SIPLACE CA

processes up to 100,000 SMT component,

42,000  ip-chips or 28,000 die-attach

components per hour.

ASM offers with the SIPLACE CA a global-

ly unique solution that opens up an entrely

new set of possibilities in embedding,

WLFO packaging, and SiP processes.

In addition, the four-gantry SIPLACE CA

provides capacities wherever you need

them. Depending on your current require-

ments, it can apply its capabilities exclusi-

vely to the recon guration of bare dies or

 ip chips or the placement of SMT compo-

nents, or a combination of the two.

SIPLACE CA

Closing the gap between chip assembly

and SMT processes

▪ Processes large panels (650 mm × 700 mm) at

maximum speed

▪ Handles SMT components and dies from wafer in a

single machine – perfect for SiP (system-in-package)

production

▪ Maximum placement accuracy

Panels up to 330 mm × 330 mm: 10 µm @ 3 sigma

large panels: 15 µm @ 3 sigma

▪ CPH ratings: up to 100,000 for SMT; up to 42,000 for

flip-chips from wafers; up to 100,000 for die-attach

from wafers

▪ Consistently high placement performance for SMT

components ranging from 0201 to 27 mm × 27 mm