17-2756-ASM Broschüre ASM AP EN_171020 - 第12页

Die Attach & SMT Deposition 1 2 Printing Stencil technology Whether fan-in, fan-out or embedded chips – encapsulating and protecting elec- tronic components in epoxy mold com- pounds is an important step in WLP/PLP a…

Populated 300 mm (12-inch) carrier for the wafer level fan out process

Die Attach & SMT

Encapsulation Singulation

WLP Inspection,

Text & Packing

Flexible wafer modules enable you to feed

the SIPLACE CA in Die Attach and Flip

Chip process directly from the wafer and

transfer them to panels with exceptional

speed and precision. And thanks to its  e-

xible conveyor, you can process substrate-

swith sizes of up to 650 mm × 700 mm.

These features are not the only strengths

of the SIPLACE CA. It also handles the

whole spectrum of classic SMT compon-

ents via tapes and feeders and does it all

with breathtaking speed. With its four SIP-

LACE SpeedStar heads, the SIPLACE CA

processes up to 100,000 SMT component,

42,000  ip-chips or 28,000 die-attach

components per hour.

ASM offers with the SIPLACE CA a global-

ly unique solution that opens up an entrely

new set of possibilities in embedding,

WLFO packaging, and SiP processes.

In addition, the four-gantry SIPLACE CA

provides capacities wherever you need

them. Depending on your current require-

ments, it can apply its capabilities exclusi-

vely to the recon guration of bare dies or

 ip chips or the placement of SMT compo-

nents, or a combination of the two.

SIPLACE CA

Closing the gap between chip assembly

and SMT processes

▪ Processes large panels (650 mm × 700 mm) at

maximum speed

▪ Handles SMT components and dies from wafer in a

single machine – perfect for SiP (system-in-package)

production

▪ Maximum placement accuracy

Panels up to 330 mm × 330 mm: 10 µm @ 3 sigma

large panels: 15 µm @ 3 sigma

▪ CPH ratings: up to 100,000 for SMT; up to 42,000 for

flip-chips from wafers; up to 100,000 for die-attach

from wafers

▪ Consistently high placement performance for SMT

components ranging from 0201 to 27 mm × 27 mm

Die Attach & SMTDeposition

PrintingStencil technology

Whether fan-in, fan-out or embedded

chips – encapsulating and protecting elec-

tronic components in epoxy mold com-

pounds is an important step in WLP/PLP

and SiP processes.

Granulate or liquid epoxy resin, different

EMC patterns, wafers or panels as carri-

ers, the degree of automation – there are

many process details that determine the

requirements for your solution. ORCAS

(Over-molding of Resin Epoxy Compres-

sion Auto-Panel Encapsulation System) is

the most  exible option on the market.

Coplanarity Control

Take closed-loop coplanarity control, for

example. Sensors detect thickness

variations in the substrate and adjust the

tooling accordingly. The SCARA wafer

handling robot can handle wafers that are

warped by up to 3 mm. Thanks to copla-

narity control, ORCAS recognizes and

compensates for even the  nest variations

in substrate thickness.

ORCAS also features maximum auto-

mation  exibility. With manual load, it is

the perfect solution for small-lot and proto-

type manufacturing, while fully automated

substrate handling and other functions

make it a highly ef cient solution for high-

volume production.

Molding

The efficient encapsulation solution for

advanced packaging: ORCAS

Die Attach & SMT

Encapsulation Singulation

WLP Inspection,

Text & Packing

Molding with keep-out zone (KOZ) makes

ORCAS the ideal solution for subsequent

singulation using laser separation. Thanks

to special tooling, the dicing patterns in the

keep-out zone at the edge of the carrier

remain visible after the molding process.

The laser-dicing process takes place with

exceptional precision and thus, without

any other preparatory steps – a prime

example of how ef ciently process chains

in advanced packaging can be integrated

and improved. The result: Improved yield

rates and the ability to make packaging

even more ef cient.

ORCAS

Quick and efficient molding

▪ Panel sizes up to 340 mm × 340 mm

and 12-inch wafers

▪ Closed-loop press system ensures

excellent coplanarity in large-area

molding applications (TTV: 20 µm)

▪ A highly flexible dispensing system

ensures best compound coverage

by processing liquid and granular

encapsulant

▪ Scalable from small-lot and prototype

manufacturing to high-volume

production

▪ One system for die-up and die-down

molding

▪ Two molding options: Molding,

configurable for with keep-out zone

(KOZ) or overmolding

In KOZ molding the edge of the wafer is not covered with EMC to make

the subsequent singulation process more efficient.

Simply clever:

Molding with keep-out zone

Top Mold Case

Film

Molding Compound

Substrate

Bottom Mold Case

Top Mold Case

Film

Molding Compound

Substrate

Bottom Mold Case

In overmolding the whole wafer is covered with molding

compound to also protect the edges.