17-2756-ASM Broschüre ASM AP EN_171020 - 第13页

Die Attach & SMT Encapsulation Singulation WLP Inspection, T ext & Packing 3 4 5 Molding with keep-out zone (KOZ) makes ORCAS the ideal solution for subsequent singulation using laser separation. Thanks to specia…

Die Attach & SMTDeposition

PrintingStencil technology

Whether fan-in, fan-out or embedded

chips – encapsulating and protecting elec-

tronic components in epoxy mold com-

pounds is an important step in WLP/PLP

and SiP processes.

Granulate or liquid epoxy resin, different

EMC patterns, wafers or panels as carri-

ers, the degree of automation – there are

many process details that determine the

requirements for your solution. ORCAS

(Over-molding of Resin Epoxy Compres-

sion Auto-Panel Encapsulation System) is

the most  exible option on the market.

Coplanarity Control

Take closed-loop coplanarity control, for

example. Sensors detect thickness

variations in the substrate and adjust the

tooling accordingly. The SCARA wafer

handling robot can handle wafers that are

warped by up to 3 mm. Thanks to copla-

narity control, ORCAS recognizes and

compensates for even the  nest variations

in substrate thickness.

ORCAS also features maximum auto-

mation  exibility. With manual load, it is

the perfect solution for small-lot and proto-

type manufacturing, while fully automated

substrate handling and other functions

make it a highly ef cient solution for high-

volume production.

Molding

The efficient encapsulation solution for

advanced packaging: ORCAS

Die Attach & SMT

Encapsulation Singulation

WLP Inspection,

Text & Packing

Molding with keep-out zone (KOZ) makes

ORCAS the ideal solution for subsequent

singulation using laser separation. Thanks

to special tooling, the dicing patterns in the

keep-out zone at the edge of the carrier

remain visible after the molding process.

The laser-dicing process takes place with

exceptional precision and thus, without

any other preparatory steps – a prime

example of how ef ciently process chains

in advanced packaging can be integrated

and improved. The result: Improved yield

rates and the ability to make packaging

even more ef cient.

ORCAS

Quick and efficient molding

▪ Panel sizes up to 340 mm × 340 mm

and 12-inch wafers

▪ Closed-loop press system ensures

excellent coplanarity in large-area

molding applications (TTV: 20 µm)

▪ A highly flexible dispensing system

ensures best compound coverage

by processing liquid and granular

encapsulant

▪ Scalable from small-lot and prototype

manufacturing to high-volume

production

▪ One system for die-up and die-down

molding

▪ Two molding options: Molding,

configurable for with keep-out zone

(KOZ) or overmolding

In KOZ molding the edge of the wafer is not covered with EMC to make

the subsequent singulation process more efficient.

Simply clever:

Molding with keep-out zone

Top Mold Case

Film

Molding Compound

Substrate

Bottom Mold Case

Top Mold Case

Film

Molding Compound

Substrate

Bottom Mold Case

In overmolding the whole wafer is covered with molding

compound to also protect the edges.

Die Attach & SMTDeposition

PrintingStencil technology

Declining component sizes and wafer

thickness, and the desire for more efcien-

cy, i.e. more density on WLP/PLP carriers,

require increasingly accurate and gentle

component singulation capabilities.

Classic saws encounter limitations in

terms of cutting width and accuracy when

they cut into the carrier (for example, with

low-K materials and the resulting threat of

contamination) as well at the end of the

packaging process. In addition, the

packages are subject to mechanical

stresses during the sawing process.

ASM‘s LASER 1205 multi-beam laser

system is the answer to the rising require-

ments in singulation.

At substrate thicknesses of 100 µm, the

cutting width stays below 12-14 µm with a

positioning tolerance of less than < 1 µm.

The machine can cut a wide range of

materials like silicon wafer (Si, SiC etc.)

with thicknesses of up to 250 μm and

EMCs with thicknesses of up to 700 µm.

Thanks to multi-beam technology, signi-

cantly fewer cutting cycles are needed to

separate the wafers. As a result, the ASM

LASER 1205 achieves exceptionally short

cycle times and a correspondingly high

level of productivity.

Singulation

More precision and efficiency:

Singulation with the LASER 1205 multi-beam laser system

LASER 1205

Precise and efficient for silicon and EMC

▪ Enabling technology for fan-in applications

▪ Precise dicing of molding compound and silicon

▪ Higher yield due to minimized dicing street (12-14 µm)

▪ No wafer-chipping since the laser cut is aligned precisely

within the pre-cut position

▪ Seamless transition from fan-in to fan-out with the same basic

packaging platform intact