17-2756-ASM Broschüre ASM AP EN_171020 - 第15页

Die Attach & SMT Encapsulation Singulation WLP Inspection, T ext & Packing 3 4 5 15

Die Attach & SMTDeposition

PrintingStencil technology

Declining component sizes and wafer

thickness, and the desire for more efcien-

cy, i.e. more density on WLP/PLP carriers,

require increasingly accurate and gentle

component singulation capabilities.

Classic saws encounter limitations in

terms of cutting width and accuracy when

they cut into the carrier (for example, with

low-K materials and the resulting threat of

contamination) as well at the end of the

packaging process. In addition, the

packages are subject to mechanical

stresses during the sawing process.

ASM‘s LASER 1205 multi-beam laser

system is the answer to the rising require-

ments in singulation.

At substrate thicknesses of 100 µm, the

cutting width stays below 12-14 µm with a

positioning tolerance of less than < 1 µm.

The machine can cut a wide range of

materials like silicon wafer (Si, SiC etc.)

with thicknesses of up to 250 μm and

EMCs with thicknesses of up to 700 µm.

Thanks to multi-beam technology, signi-

cantly fewer cutting cycles are needed to

separate the wafers. As a result, the ASM

LASER 1205 achieves exceptionally short

cycle times and a correspondingly high

level of productivity.

Singulation

More precision and efficiency:

Singulation with the LASER 1205 multi-beam laser system

LASER 1205

Precise and efficient for silicon and EMC

▪ Enabling technology for fan-in applications

▪ Precise dicing of molding compound and silicon

▪ Higher yield due to minimized dicing street (12-14 µm)

▪ No wafer-chipping since the laser cut is aligned precisely

within the pre-cut position

▪ Seamless transition from fan-in to fan-out with the same basic

packaging platform intact

Die Attach & SMT

Encapsulation Singulation

WLP Inspection,

Text & Packing

Stencil PrintingDeposition

PrintingStencil technology

SUNBIRD

Extremely efficient inspection, sorting

and taping

▪ Combines various optical and electrical inspection

and (optional) laser marking capabilities in one

machine

▪ More reliable detection of faults by individual optical

inspection

▪ Maximum speed of 30,000 UPH thanks to turret

system

▪ Contactless alignment and smart chip handling

ensure optimal package protection

▪ Handling of smallest components (0603/0402 metric)

Dies are picked directly from the wafer to the turret system and transported

through various optical inspection and electrical test positions.

Six-side inspection, electrical tests,

laser marking, sorting and taping – the

SUNBIRD system combines a series of

functions in a single machine. And best of

all, thanks to the SUNBIRD turret system,

it does it all with a high degree of speed

and efciency.

In a rst step, the machine picks up the

packages with its ip arm, inspects their

bottom side and passes them to the turret,

where they are inspected from six angles,

tested, and optionally laser-marked.

Thanks to the SUNBIRD‘s smart iPrecise

and iAlign technologies, the alignment of

all components is ensured and optimized

via powerful optics and without any additi-

onal transfers.

Next, the SiP components are gently positi-

oned in tape pockets with automatic Z-axis

alignment, under the continuous check

of a vision system, which was especially

developed for this purpose. That way, even

extremely small, thin and sensitive dies can

be inspected and taped perfectly.

The nal sorting step: Divided by software

into separate classes, the machine places

the components into the tape or different

containers. With processing speeds of up

to 30,000 UPH, SUNBIRD represents a

signicant speed and quality improvement

over traditional systems.

WLP Inspection, Test & Packing

Finalizing your WLP/PLP processes:

SUNBIRD for inspecting, sorting and taping