17-2756-ASM Broschüre ASM AP EN_171020 - 第17页

Stencil Printing Ball Drop Singulation WLP Inspection, T ext & Packing 3 4 5 17

Stencil PrintingDeposition

PrintingStencil technology

SUNBIRD

Extremely efficient inspection, sorting

and taping

▪ Combines various optical and electrical inspection

and (optional) laser marking capabilities in one

machine

▪ More reliable detection of faults by individual optical

inspection

▪ Maximum speed of 30,000 UPH thanks to turret

system

▪ Contactless alignment and smart chip handling

ensure optimal package protection

▪ Handling of smallest components (0603/0402 metric)

Dies are picked directly from the wafer to the turret system and transported

through various optical inspection and electrical test positions.

Six-side inspection, electrical tests,

laser marking, sorting and taping – the

SUNBIRD system combines a series of

functions in a single machine. And best of

all, thanks to the SUNBIRD turret system,

it does it all with a high degree of speed

and efciency.

In a rst step, the machine picks up the

packages with its ip arm, inspects their

bottom side and passes them to the turret,

where they are inspected from six angles,

tested, and optionally laser-marked.

Thanks to the SUNBIRD‘s smart iPrecise

and iAlign technologies, the alignment of

all components is ensured and optimized

via powerful optics and without any additi-

onal transfers.

Next, the SiP components are gently positi-

oned in tape pockets with automatic Z-axis

alignment, under the continuous check

of a vision system, which was especially

developed for this purpose. That way, even

extremely small, thin and sensitive dies can

be inspected and taped perfectly.

The nal sorting step: Divided by software

into separate classes, the machine places

the components into the tape or different

containers. With processing speeds of up

to 30,000 UPH, SUNBIRD represents a

signicant speed and quality improvement

over traditional systems.

WLP Inspection, Test & Packing

Finalizing your WLP/PLP processes:

SUNBIRD for inspecting, sorting and taping

Stencil Printing

Ball Drop Singulation

WLP Inspection,

Text & Packing

ASM SMT Solutions

▪ SMT Line Solution

▪ DEK Printing Solutions

▪ SIPLACE Placement Solutions

▪ ASM Smart Factory

Tools & Services

ASM Materials

▪ Leadframes

▪ Other Materials

▪ Molded Interconnect

Substrate (MIS)

ASM Back End Equipment

▪ Die & Flip-Chip Bonder

▪ Wire Bonder

▪ Encapsulation Equipment

▪ Tester & Sorter

▪ Laser Dicing

▪ LED Equipment

ASM Pacific Technologies

Market

SMT Equipment

(Printing & Placement)

SMT Equipment

Market

Assembly & Packaging

Equipment

Assembly & Packaging

Market

Leadframes

Market

ASM Back End Equipment

Die & Flip-Chip Bonder

The underlying idea makes a lot of sense.

Instead of combining the components for

a module on the circuit board, advanced

packaging  rst integrates dies or  ip-chips

with other SMT components into an SiP,

which is then placed on the board.

This process allows for further miniatu-

rization, eliminates the time-consuming

wire-bonding of dies and frees users from

designing required functionalities on their

own. The complete function group can be

placed as a single module.

This convergence of chip assembly and

SMT processes opens up new opportu-

nities. Whether semiconductor makers

or electronics manufacturers enter this

new market – either industry requires the

other’s process knowledge and expe-

rience.

ASM is your partner of choice

ASM is active in both segments. It is the

world’s only equipment supplier that has

been active and successful in both indus-

tries – chip assembly and SMT.

Invest in a growth market

Major trends like digitalization and networking are currently strengthening

the interest in advanced packaging technologies worldwide.