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ASM SMT Solutions ▪ SMT Line Solution ▪ DEK Printing Solutions ▪ SIPLACE Placement Solutions ▪ ASM Smart Factory T ools & Services ASM Materials ▪ Leadframes ▪ Other Materials ▪ Molded Interconnect Substrate (MIS) AS…

Stencil Printing

Ball Drop Singulation

WLP Inspection,

Text & Packing

ASM SMT Solutions

▪ SMT Line Solution

▪ DEK Printing Solutions

▪ SIPLACE Placement Solutions

▪ ASM Smart Factory

Tools & Services

ASM Materials

▪ Leadframes

▪ Other Materials

▪ Molded Interconnect

Substrate (MIS)

ASM Back End Equipment

▪ Die & Flip-Chip Bonder

▪ Wire Bonder

▪ Encapsulation Equipment

▪ Tester & Sorter

▪ Laser Dicing

▪ LED Equipment

ASM Pacific Technologies

Market

SMT Equipment

(Printing & Placement)

SMT Equipment

Market

Assembly & Packaging

Equipment

Assembly & Packaging

Market

Leadframes

Market

ASM Back End Equipment

Die & Flip-Chip Bonder

The underlying idea makes a lot of sense.

Instead of combining the components for

a module on the circuit board, advanced

packaging  rst integrates dies or  ip-chips

with other SMT components into an SiP,

which is then placed on the board.

This process allows for further miniatu-

rization, eliminates the time-consuming

wire-bonding of dies and frees users from

designing required functionalities on their

own. The complete function group can be

placed as a single module.

This convergence of chip assembly and

SMT processes opens up new opportu-

nities. Whether semiconductor makers

or electronics manufacturers enter this

new market – either industry requires the

other’s process knowledge and expe-

rience.

ASM is your partner of choice

ASM is active in both segments. It is the

world’s only equipment supplier that has

been active and successful in both indus-

tries – chip assembly and SMT.

Invest in a growth market

Major trends like digitalization and networking are currently strengthening

the interest in advanced packaging technologies worldwide.

ASM PT worldwide

▪ Present in over

30 countries

▪ Over 15,500 employees,

including 1,700 in R&D

▪ Five Centers of

Competence

▪ Six R&D centers

▪ 10 production locations

▪ 1,100 patents in cutting-

edge technologies

With our process, hardware and software

specialists, we are a strategic partner of

many companies in both industries, and

as a technology leader with innovative

solutions we keep setting new standards

in quality and productivity.

This makes ASM your partner of choice

for the development, implementation and

optimization of consistently integrated

and highly automated processes in chip

assembly, advanced packaging, and SMT

production. We offer end-to-end solution

chains and tailor them to the individual

requirements and processes of our custo-

mers. This brochure presented one exam-

ple of such a solution chain.

If you are interested in putting the oppor-

tunities and the potential of advanced

packaging to use for your company, get in

touch with our experts. By partnering with

us you bene t not only from our extensive

product portfolio, but also from our unique

process expertise.

Your advantage: You do it right the  rst

time – while lowering your risks and

costs.