17-2756-ASM Broschüre ASM AP EN_171020 - 第19页
ASM PT worldwide ASM PT worldwide ▪ Present in over 30 countries ▪ Over 15,500 employees, including 1,700 in R&D ▪ Five Centers of Competence ▪ Six R&D centers ▪ 10 production locations ▪ 1,100 patents in cutting…
ASM SMT Solutions
▪ SMT Line Solution
▪ DEK Printing Solutions
▪ SIPLACE Placement Solutions
▪ ASM Smart Factory
Tools & Services
ASM Materials
▪ Leadframes
▪ Other Materials
▪ Molded Interconnect
Substrate (MIS)
ASM Back End Equipment
▪ Die & Flip-Chip Bonder
▪ Wire Bonder
▪ Encapsulation Equipment
▪ Tester & Sorter
▪ Laser Dicing
▪ LED Equipment
ASM Pacific Technologies
Market
SMT Equipment
(Printing & Placement)
SMT Equipment
Market
Assembly & Packaging
Equipment
Assembly & Packaging
Market
Leadframes
Market
ASM Back End Equipment
Die & Flip-Chip Bonder
The underlying idea makes a lot of sense.
Instead of combining the components for
a module on the circuit board, advanced
packaging rst integrates dies or ip-chips
with other SMT components into an SiP,
which is then placed on the board.
This process allows for further miniatu-
rization, eliminates the time-consuming
wire-bonding of dies and frees users from
designing required functionalities on their
own. The complete function group can be
placed as a single module.
This convergence of chip assembly and
SMT processes opens up new opportu-
nities. Whether semiconductor makers
or electronics manufacturers enter this
new market – either industry requires the
other’s process knowledge and expe-
rience.
ASM is your partner of choice
ASM is active in both segments. It is the
world’s only equipment supplier that has
been active and successful in both indus-
tries – chip assembly and SMT.
Invest in a growth market
Major trends like digitalization and networking are currently strengthening
the interest in advanced packaging technologies worldwide.
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ASM PT worldwide
ASM PT worldwide
▪ Present in over
30 countries
▪ Over 15,500 employees,
including 1,700 in R&D
▪ Five Centers of
Competence
▪ Six R&D centers
▪ 10 production locations
▪ 1,100 patents in cutting-
edge technologies
With our process, hardware and software
specialists, we are a strategic partner of
many companies in both industries, and
as a technology leader with innovative
solutions we keep setting new standards
in quality and productivity.
This makes ASM your partner of choice
for the development, implementation and
optimization of consistently integrated
and highly automated processes in chip
assembly, advanced packaging, and SMT
production. We offer end-to-end solution
chains and tailor them to the individual
requirements and processes of our custo-
mers. This brochure presented one exam-
ple of such a solution chain.
If you are interested in putting the oppor-
tunities and the potential of advanced
packaging to use for your company, get in
touch with our experts. By partnering with
us you bene t not only from our extensive
product portfolio, but also from our unique
process expertise.
Your advantage: You do it right the rst
time – while lowering your risks and
costs.
19
Issue 1/10-2017
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Order No.: A10011-ASM-A103-EN
Printed in Germany
© ASM Assembly Systems GmbH & Co. KG
The information in this brochure consists only of general
descriptions and/or performance features which may not
always apply to concrete products as described or which
may change as a result of technical developments or
advances. Any specific performance features and/or
capabilities will only be binding if contractually agreed
upon. All product names are brands or trademarks of
ASM Assembly Systems GmbH & Co. KG or other suppliers.
Their use by third parties may violate the rights of their
owners.
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www.asm-smt.com
ASM Assembly Systems GmbH & Co. KG
Rupert-Mayer-Strasse 44 | 81379 Munich | Germany
Phone: +49 89 20800-27819 | Fax: +49 89 20800-36692 | E-mail: smt-solutions.de@asmpt.com