17-2756-ASM Broschüre ASM AP EN_171020 - 第2页
Advanced Packaging/WLSiP 3 The whole solution chain from a single source 4 E-forming produces the finest multi-level apertures 6 The printing solution for advanced-packaging processes: DEK Galaxy 8 T ruly unique: SIPLACE…
Advanced Packaging
End-to-end solution chains for WLSiP
Advanced Packaging/WLSiP 3
The whole solution chain from a single source 4
E-forming produces the finest multi-level apertures 6
The printing solution for advanced-packaging
processes: DEK Galaxy 8
Truly unique: SIPLACE CA combines
bare-chip and SMT placement 10
The efficient encapsulation solution
in advanced packaging: ORCAS 12
Simply clever:
Molding with keep-out zone (KOZ) 13
More precision and efficiency: Singulation with
the LASER 1205 multi-beam system 14
Finalizing your WLP/PLP processes:
SUNBIRD for inspection, sorting and taping 16
Invest in a growth market 18
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The rising spread of mobile devices and
the Internet of Things (IoT) push the need
for ever smaller modules and components.
Electronics must be increasingly inte-
grated and produced in accordance with
the highest quality standards, but at ever
lower cost.
One response to these challenges is
advanced packaging, which integrates
bare dies or flip-chips with SMT com-
ponents to form ultra-compact systems
(system-in-package, or SiP). Advanced
packaging techniques make it possible to
create complete function modules that can
then be placed efficiently and reliably on
an SMT line.
Separately in the past, now combined.
In the past, the semiconductor – espe-
cially in back-end packaging operations
– and SMT production industries operated
separately from each other. In advanced
packaging, their processes overlap for
the first time. The result: Besides OSATs,
classic electronics manufacturers can
help out the semiconductor industry by
supplementing its operations to meet the
exploding demand for ultra-compact, SMT-
capable function modules. This opens up
an attractive growth market for the electro-
nics production industry.
Only at ASM: Everything from a single
source
ASM is your experienced partner for ente-
ring the advanced packaging market. ASM
is the world’s only equipment supplier with
solutions for all phases and process steps
in the electronics industry – from lead
frame to backend to SMT.
ASM‘s unique process and industry exper-
tise flow into its advanced packaging offe-
rings. This enables ASM to offer solutions
for each specific process from a single
source with complete, integrated solution
chains ranging from sophisticated printing
processes to the combined placement of
dies, flip-chips and SMT components to
molding, singulation, testing and packa-
ging.
ASM is an experienced and innovative
partner that backs you with competent
advice, equipment, and a wide range of
support services. With ASM, the outlook
for your entry into the attractive advanced
packaging market couldn‘t be better.
Advanced Packaging/WLSiP
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