17-2756-ASM Broschüre ASM AP EN_171020 - 第4页

1 2 The process chain for SiP applications combines classic semiconductor and SMT processes. Deposition The  rst process step is the deposition of  ux and solder paste on the substrate. Thanks to ASM‘s innovative print…

The rising spread of mobile devices and

the Internet of Things (IoT) push the need

for ever smaller modules and components.

Electronics must be increasingly inte-

grated and produced in accordance with

the highest quality standards, but at ever

lower cost.

One response to these challenges is

advanced packaging, which integrates

bare dies or flip-chips with SMT com-

ponents to form ultra-compact systems

(system-in-package, or SiP). Advanced

packaging techniques make it possible to

create complete function modules that can

then be placed efficiently and reliably on

an SMT line.

Separately in the past, now combined.

In the past, the semiconductor – espe-

cially in back-end packaging operations

– and SMT production industries operated

separately from each other. In advanced

packaging, their processes overlap for

the first time. The result: Besides OSATs,

classic electronics manufacturers can

help out the semiconductor industry by

supplementing its operations to meet the

exploding demand for ultra-compact, SMT-

capable function modules. This opens up

an attractive growth market for the electro-

nics production industry.

Only at ASM: Everything from a single

source

ASM is your experienced partner for ente-

ring the advanced packaging market. ASM

is the world’s only equipment supplier with

solutions for all phases and process steps

in the electronics industry – from lead

frame to backend to SMT.

ASM‘s unique process and industry exper-

tise flow into its advanced packaging offe-

rings. This enables ASM to offer solutions

for each specific process from a single

source with complete, integrated solution

chains ranging from sophisticated printing

processes to the combined placement of

dies, flip-chips and SMT components to

molding, singulation, testing and packa-

ging.

ASM is an experienced and innovative

partner that backs you with competent

advice, equipment, and a wide range of

support services. With ASM, the outlook

for your entry into the attractive advanced

packaging market couldn‘t be better.

Advanced Packaging/WLSiP

1 2

The process chain for SiP applications

combines classic semiconductor and SMT

processes.

Deposition

The  rst process step is the deposition

of  ux and solder paste on the substrate.

Thanks to ASM‘s innovative printing tech-

nologies, this can be done quickly and

ef ciently with the precision required for

wafer-level operations.

Multilevel e-formed stencils have become

the standard for this process. With the

additive e-forming process, stencils can be

produced with the ultra- ne apertures and

gradations required for  ux/solder paste

printing and wafer bumping.

The ideal platform for this stencil tech-

nology is the powerful and versatile DEK

Galaxy, whose exceptional precision and

 exible options make it the ideal solution

for a wide range of printing applications in

the advanced packaging  eld.

Placement

SiP require extremely precise machines

that can take components directly from the

wafer as well as from classic tape feeders

and place them onto the various substrates

such as circuit boards, wafers or panels.

In the case of WLSiP, Dies and SMT com-

ponents are placed directly on the wafer.

This is made possible by powerful wafer

handlers for various formats and pickup

processes for bare dies and  ip-chips. After

the substrates have been populated, they

go through a re ow process.

The whole solution chain from a single source

Wafer-level System-in-Package (SiP) Process

DIE ATTACH & SMT

SIPLACE CA

Combined placement from

wafers and SMT feeders

DEPOSITION

EFORM STENCIL

TECHNOLOGY

Ultra-precise multi-level stencils

DEK Galaxy

The solution for printing

and bumping

3 4 5

The whole solution chain from a single source

Wafer-level System-in-Package (SiP) Process

ENCAPSULATION

ORCAS

Flexible molding

SINGULATION

LASER 1205

Precise and efficient

laser-cutting

WLP INSPECTION,

TEST & PACKAGING

SUNBIRD

Highly efficient all-in-one

solution

Molding

Next, the substrates with the SiPs is mol-

ded, usually via press-forming with epoxy.

For these and the subsequent SiP process

steps such as redistribution layer in thin-

layer technology, proven tools from the

semiconductor industry is normally used,

which explains why most SiP processes

operate with wafer-shaped panels.

Singulation

In the singulation process, classic saws

have been replaced by laser-based solu-

tions, because they are faster and more

accurate. Even more modern solutions

already operate with multi-beam lasers.

From testing to taping

The SiP must be picked up, optically in-

spected, tested, sorted, marked, labeled,

and packaged in tapes for the placement

process. Modern solutions have turrets and

combine these steps in a single machine.

End-to-end solution chain

All of these steps form a multi-layered,

complex process that can only be managed

with a consistently coordinated solution

chain as well as with lots of experience and

competence. Only ASM can offer this solu-

tion chain from a single source. Check out

the following pages for more details.