17-2756-ASM Broschüre ASM AP EN_171020 - 第6页

Deposition Printing Stencil technology Die Attach & SMT 1 2 The assembly of ultra-compact SiP de- signs requires maximum precision and extremely thin stencils with ultra- ne apertures. This is the only way to achiev…

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The whole solution chain from a single source

Wafer-level System-in-Package (SiP) Process

ENCAPSULATION

ORCAS

Flexible molding

SINGULATION

LASER 1205

Precise and efficient

laser-cutting

WLP INSPECTION,

TEST & PACKAGING

SUNBIRD

Highly efficient all-in-one

solution

Molding

Next, the substrates with the SiPs is mol-

ded, usually via press-forming with epoxy.

For these and the subsequent SiP process

steps such as redistribution layer in thin-

layer technology, proven tools from the

semiconductor industry is normally used,

which explains why most SiP processes

operate with wafer-shaped panels.

Singulation

In the singulation process, classic saws

have been replaced by laser-based solu-

tions, because they are faster and more

accurate. Even more modern solutions

already operate with multi-beam lasers.

From testing to taping

The SiP must be picked up, optically in-

spected, tested, sorted, marked, labeled,

and packaged in tapes for the placement

process. Modern solutions have turrets and

combine these steps in a single machine.

End-to-end solution chain

All of these steps form a multi-layered,

complex process that can only be managed

with a consistently coordinated solution

chain as well as with lots of experience and

competence. Only ASM can offer this solu-

tion chain from a single source. Check out

the following pages for more details.

Deposition

PrintingStencil technology

Die Attach & SMT

The assembly of ultra-compact SiP de-

signs requires maximum precision and

extremely thin stencils with ultra- ne

apertures. This is the only way to achieve

the area ratio parameters that permit a

reliable release of the print media and

ensure a stable printing process.

In addition, specially developed multi-layer

stencil technology is used to place solder

balls directly on the substrate. In a  rst

step,  ux is applied, which is important for

the soldering process. Next, the solder

balls for the SMT components are applied

in a second printing process. This would

be impossible without specially developed

multi-level stencils whose cavities leave

the  ux deposits untouched.

Classic etching or laser-cutting methods

quickly hit their limits with such stencils,

which is why ASM has for many years pu-

shed the development of electroforming as

an additive manufacturing method for high-

precision stencils. With a galvanic process

and supported by lithography, multi-level

stencils can be made from various materi-

als with tolerances in the nanometer range.

Another plus of DEK e-formed stencils is

the extremely high quality of their surfaces

and aperture walls, which makes for signi-

 cantly improved printing media release

characteristics, more accurate paste de-

posits, and reduced understencil cleaning

frequencies.

In summary, the combination of DEK

E-Form high-precision stencils and DEK

printing solutions lets you manage your

printing process with ef ciency and relia-

bility.

Stencil Technology

E-forming produces the finest multi-level apertures

Die Attach & SMT

Encapsulation Singulation

WLP Inspection,

Text & Packing

ELECTROFORM STENCIL PRODUCTS SPECIFICATIONS

Platinum Stencil Product Range

Aperture (hole) size tolerance ±4 μm

Aperture positional tolerance distance < 50 mm ±50 µm

> 50 mm 0.1 µ/mm (VG) , 0.3 µ/mm (mesh mounted)

Thickness tolerance ±5 % of thickness

Fiducials max. 8

Material nickel 500 HV ±50

Aperture checking 10 apertures

Thickness checking 5 × in Image area + coc

X/Y accuracy check + coc

Documentation extended + drawing

Scan (presence/absence) 100 %

RECOMMENDED PRINT APPLICATIONS

semiconductor packaging

wafer level printing

LED and/or trace printing

high accuracy printing

multi layer stencil

aperture sizes down to 25 µ

min. thickness possible 20 µ (0.75mil)

Mask

Photoresist

Seed layer

Substrate

Photoresist

molds

Electroformed

metals

Metallic

microstructure

Source: Wikipedia

UV Light or X-rays

Electrolytic solution Electroform

Electrodeposition

process

Metal