17-2756-ASM Broschüre ASM AP EN_171020 - 第9页

TRS T ooling TRS tooling Flux printing Die Attach & SMT Encapsulation Singulation WLP Inspection, T ext & Packing 3 4 5 Flux and solder paste With the rst two printing processes, ux or solder paste are applied …

TRS Tooling

Die Attach & SMTDeposition

PrintingStencil technology

Advanced packaging places extremely

high demands on the printing process, be-

cause it requires ultra-ne apertures and

maximum precision along with separate

printing steps involving different technolo-

gies and media.

With the DEK Galaxy, our printing experts

have developed an extremely powerful,

modular and exibly congurable solution

for use in advanced-packaging processes.

Precise linear motors and a stable frame

ensure maximum precision even at high

printing speeds. In addition, ASM offers

a variety of options and accessories that

enable you to optimally adapt the DEK

Galaxy to your specic process require-

ments, starting with the conveyor, whose

standard version already accommodates a

wide range of panel sizes. Conveyor solu-

tions for high-precision (and heavy) wafer

carriers are also available.

A wide range of sensors and the

HawkEye

inspection system ensure

seamless process control. SMEMA- and

HERMES-compatible interfaces makes

it easy to integrate the machine into your

lines and processes.

Printing & Ball Drop

The printing solution for advanced packaging processes:

DEK Galaxy

TRS Tooling

TRS tooling

Flux printing

Die Attach & SMT Encapsulation Singulation

WLP Inspection,

Text & Packing

Flux and solder paste

With the rst two printing processes,

ux or solder paste are applied to the

substrates via classic stencil printing

with multi-level DEK e-form stencils.

The versatile DEK printer software ma-

kes it easy to adjust all relevant opera-

ting parameters.

Ball drop

For the ball drop process, i.e. the appli-

cation of solder balls onto the underside

of the SiPs, the DEK Galaxy provides

another solution. With its DirEKt Ball

Placement Option, solder balls can be

applied individually (ball attachment).

DEK Galaxy

Reliable printing in chip assembly

▪ For demanding wafer, substrate and circuit board

applications

▪ Process Alignment Capability: 2 Cpk @ ±12.5 µm 6 sigma

▪ ProFlow

DirEKt Imaging technologies for high-precision

ball placements

▪ Modular: Flexibly configurable with toolings and transport

systems for the widest range of advanced packaging

applications

▪ SMEMA- and HERMES-compatible interfaces to wafer

and flux solutions

▪ Fast: Core cycle time of only 7 seconds

▪ Flexible: Product changeovers take less than 2 minutes

▪ Easy to use: DEK Instinctiv™ software

Die Attach & SMTDeposition

PrintingStencil technology

Truly unique:

SIPLACE CA combines bare-chip and SMT placement

Do you combine bare-die placement with

the placement of classic SMT components

in your production? Or in other words: are

you looking for a universal machine that

you can use to populate large carriers in

panel level packaging as well as for clas-

sic SMT placement applications? These

processes used to be strictly separate –

until now.

Today, ASM is the  rst equipment maker

that can offer you more: the SIPLACE CA.

This uniquely innovative solution tears

down the borders between semiconduc-

tor backend and SMT handling. For the

 rst time you can run both processes on

a single machine – even simultaneously.

This improves your ef ciency, makes your

processes more stable by reducing the

number of required process steps, and

gives you a leg up on the competition.

High Precision Chip Placement