PI series 3D SPI brochure and specifications

A c c ur at e s ol der p ast e i nspe ctio n with u n p re c e d e n t e d si m p li cit y My cronic ins pec ti on solut ions PI ™ s e r i e s 3 D S P I

Accurate solder paste inspection

with unprecedented simplicity

Mycronic inspection solutions PI

™

series 3D SPI

Goodbye defects.

Hello solder paste perfection.

What are the most common defects in your SMT line? And what would you save

if you could catch them earlier in your process—or even eliminate them from

your design altogether?

If you’re like most manufacturers, the answers

to these questions will likely bring you back to

the solder paste printing process. Because this is

where more than 60% of all SMT defects originate,

according to our latest industry survey. Whether

theproblem is solder shorts or insucient solder

paste deposits, accurate solder paste inspection is

often the most economical way to detect, predict

and prevent defects before they occur.

As solder paste deposits continue to decrease in

size, the value of advanced SPI analysis will only

grow over time. This is precisely what makes the

innovative PIseries 3D SPI system an increasingly

critical part of acomplete metrology solution.

It allows you to measure paste volume with un-

matched accuracy and unprecedented simplicity.

Sothat you can continually improve your process

and tolerance settings—and take advantage of

theunambiguous real-time information you need

to take your yield to new heights.

It’s one more part of the Mycronic4.0

intelligent factory, and one step

closerto perfection.

PI series 3D SPI

Perfect solder joints

madesimple

Measure paste volume with extreme precision. Improve your

process and tolerance settings with automatic pad grouping.

And monitor your process in real-time, both online and o ine.

The PI series gives you highly accurate SPI data, combined

with a range of smart auto-programming functions that ensure

high-quality inspection regardless of operator experience.

INSPECTS JET-PRINTED PCB

WITHTHE SAME VIRTUOSITY

In line with the evolution of SMT manufacturing

practices, the PI series handles jet-printed PCBs with

the same inspection performances and program-

ming process as for screen-printed boards. Thesyn-

ergy with Mycronic MY700 Jet Printer enables the

inspection of all types of deposit shapes and vol-

umes, regardless of the type and viscosity ofthe

jetted paste.

Extreme inspection precision

PI series 3D SPI accurately calculates the expected

volume of paste printed by the MY700 Jet Printer.

Instead of evaluating this volume based on the

Gerber stencil data, PI series uses data transmitted

from the MY700 Jet Printer.

PI series MY700 repair loop

PI series communicates any defects resulting from

insu cient paste to the MY700, along with the

IDcode of the concerned PCB. A second run in

thejet-printer corrects the defect without having

towash and reprint the entire board.

Accurate Z-referencing technology

Captures hundreds of references across

anultra-large 55x350mm 3Dﬁ eld of view.

PI series 3D SPI verifying paste defect has been

corrected by the MY700 Jet Printer.

Simple auto-programming

Ensure high-quality inspection regardless of

operator experience with the industry’s only

auto-programming SPI.

Repeatable process results

Unique warp compensation delivers

accurate measurements in real production

environments, with nofalse calls.

Inspection of jetted paste deposits.

MY700 Jet Printer

and PI series 3D SPI.

MY700 Jet Printer combined

with PI series 3D SPI provides

near zero-defect solder

paste printing process.

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