PI series 3D SPI brochure and specifications - 第4页
Cl ear and s impl e inspe ctio n c ontro l Thank s to a natural touch screen inter face, the PI se ries can easily b e set up and run by any one with just an hour ’s training . This intuitiv e design allow s any op erat …
PI series 3D SPI
Perfect solder joints
madesimple
Measure paste volume with extreme precision. Improve your
process and tolerance settings with automatic pad grouping.
And monitor your process in real-time, both online and o ine.
The PI series gives you highly accurate SPI data, combined
with a range of smart auto-programming functions that ensure
high-quality inspection regardless of operator experience.
INSPECTS JET-PRINTED PCB
WITHTHE SAME VIRTUOSITY
In line with the evolution of SMT manufacturing
practices, the PI series handles jet-printed PCBs with
the same inspection performances and program-
ming process as for screen-printed boards. Thesyn-
ergy with Mycronic MY700 Jet Printer enables the
inspection of all types of deposit shapes and vol-
umes, regardless of the type and viscosity ofthe
jetted paste.
Extreme inspection precision
PI series 3D SPI accurately calculates the expected
volume of paste printed by the MY700 Jet Printer.
Instead of evaluating this volume based on the
Gerber stencil data, PI series uses data transmitted
from the MY700 Jet Printer.
PI series MY700 repair loop
PI series communicates any defects resulting from
insu cient paste to the MY700, along with the
IDcode of the concerned PCB. A second run in
thejet-printer corrects the defect without having
towash and reprint the entire board.
Accurate Z-referencing technology
Captures hundreds of references across
anultra-large 55x350mm 3Dfi eld of view.
PI series 3D SPI verifying paste defect has been
corrected by the MY700 Jet Printer.
Simple auto-programming
Ensure high-quality inspection regardless of
operator experience with the industry’s only
auto-programming SPI.
Repeatable process results
Unique warp compensation delivers
accurate measurements in real production
environments, with nofalse calls.
Inspection of jetted paste deposits.
MY700 Jet Printer
and PI series 3D SPI.
MY700 Jet Printer combined
with PI series 3D SPI provides
near zero-defect solder
paste printing process.
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Clear and simple
inspection control
Thanks to a natural touchscreen interface, the PI series can easily be
set up and run by anyone with just an hour’s training. This intuitive
design allows any operator to quickly access the system’s full
capabilities with no additional calibration or fine-tuning.
Eortless
auto-programming
The industry’s only auto-programming SPI system, the PI series
requires only a single bare board scan to accurately program itself.
No fine tuning. No manual calibration. And no unnecessary training
times needed to bring programmers or operators up to speed.
Intuitive touchscreen interface
makes all system capabilities
easy to access and navigate,
with no need for keyboard or
mouse inputs.
Automatic calibration is carried
out with the touch of a button.
Consistent performance
overtime is ensured by
embedded geometric and
radiometric calibration tools,
which also guarantee machine-
to-machine portability.
Let the system program itself
with just one bare board scan.
No fine tuning required due
to smart auto-programming
functions. Performance remains
consistent regardless of color
or finish variations, making the
PI series ideal for new product
introductions.
Simultaneous glue dot inspection
capabilities, in addition to paste
inspection.
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Measure paste volume with
unmatched accuracy
The PI series’ patented Z-referencing technology captures hundreds
of references across an ultra-large 3D field of view, giving you
unprecedented accuracy for even the smallest paste volume
measurements.
Take control over
your print process
PI’s automatic pad grouping by AAR (Area Aperture Ratio) allows you to continuously
improve your process and set tolerances independently of products. Together with
the MYPro Link software suite, this means you can transform your inspection data
into actionable process information.
Highly accurate paste volume
measurement using a patented
Z-referencing technology that
overcomes the limitations of
traditional SPI systems.
Superior accuracy in real
production environments
withno false calls due to a
unique warp compensation
enabled by multi-frequency,
multi-pattern moiré, com-
bined with patented dual
Z-axis motion.
Unambiguous information
for defect classification
with high-resolution textured
3Dimages.
Improve your process and
set tolerances independently
of products with meaningful
automatic pad grouping
by AAR.
Gain new insights into your
process with extra-large review
images in textured 3D for easy
diagnostics.
Monitor your process in realtime
with MYPro Analyze, which helps
you report and monitor your
progress with useful trend
analyses.
PI
Stable Z-reference
Unstable Z-reference
Not measured
TRADITIONAL SPI
Threshold at ~40μm
Not measured
Traditional SPI: The typical threshold for a traditional SPI is usually 30–40micro-
meters (μm), meaning height and volume under this limit goes unmeasured. Asa
result, volume is underestimated on small pads, preciselywhen you need to know
how much paste is truly deposited.
PI series: PI’s patented
Z-referencing method
leverages the entire
textured 3D board
information, rather than
just cropped images
around the pads, to
define a stable and
accurate Z-reference.
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