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1OM-1505 4. T est Print and Automatic Operation : Chap.4 4-19 0906-001 4. T est Print and Automatic Operation 4.1 T est Print Print a PCB in each of backward and forward printing mode, and check the print result. If any …

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3.13 Paste Kneading

Knead solder paste on the stencil using the "Paste Kneading" tab sheet in the

"INDIVIDUAL SETUP" window (Operation Sequence: [PRODUCT CHG.]

button in the main menu → [INDIVIDUAL SETUP] button → [Paste Kneading]

tab).

Note

In the case of well kneaded solder paste, this operation is not required.

Reference

Refer to "5.4 Paste Kneding" in "Chapter 3 (Vol. 2)" for details.

1OM-1505

4. Test Print and Automatic Operation : Chap.4

4-190906-001

4. Test Print and Automatic Operation

4.1 Test Print

Print a PCB in each of backward and forward printing mode, and check the print

result. If any positional deviation is found, correct the parameters for "Printing

Correction (Back)" and "Printing Correction (For.)" in the "Print" tab sheet in the

"Pattern Program" edit window.

Note

The correction of inaccurate position data can be performed using the teaching

operation.

Reference

Refer to "7.1 Inaccurate Posn. Correction" in "Chapter 3 (Vol. 2)" for details.

4.2 Automatic Operation

Display the "Product." window on the touch screen and press the [START] button

on the operation panel to start the PCB production.

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4. Test Print and Automatic Operation : Chap.4

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