1OM-1505-004_w - 第49页
Contents Page 1OM-1505 Cont-4 1002-002 Chapter 3 Outline of Automatic Operation 1. Automatic Operation ...................................................................... 3- 1 1.1 Inspections before Automatic Operatio…
Contents
Page
1OM-1505
Cont-31002-003
5.11 Backup Pin
Automatic Replacement Function ........................ 1- 26
5.12 Printing Pressure Feedback Function ..................................... 1- 2
7
Chapter 2 Operation Windows
1. Startup ............................................................................................ 2- 1
1.1 "Top" Window .......................................................................... 2- 2
1.2 Select Login User ................................................................... 2- 3
1.2.1 Login Procedure ............................................................ 2- 4
2. Operation Window .......................................................................... 2- 5
2.1 Control Menu .......................................................................... 2- 9
2.2 Recognition Window ............................................................... 2- 11
3. Data Input ....................................................................................... 2- 13
3.1 Numerical Data Input .............................................................. 2- 13
3.2 Character Data Input .............................................................. 2- 14
4. Shutdown ....................................................................................... 2- 15
4.1 Logout ..................................................................................... 2- 15
4.2 Power OFF Operation ............................................................. 2- 16
4.3 Locking the Power Breaker ..................................................... 2- 18
Contents
Page
1OM-1505
Cont-41002-002
Chapter 3 Outline of Automatic Operation
1. Automatic Operation ...................................................................... 3- 1
1.1 Inspections before Automatic Operation ................................. 3- 2
1.1.1 Conrmation of Power Supply ....................................... 3- 2
1.1.2 Conrmation of Air Pressure .......................................... 3- 2
1.1.3 Cover Section Check ..................................................... 3- 3
1.1.4 Safety Check for Surrounding Area of the Machine ...... 3- 4
1.2 Preparation before Operation ................................................. 3- 5
1.2.1 Power Input ................................................................... 3- 5
1.2.2 Preparation for Solder Paste ......................................... 3- 6
1.3 Start of Automatic Operation ................................................... 3- 7
1.3.1 Starting the System Program ........................................ 3- 7
1.3.2 Login Operation ............................................................. 3- 8
1.3.3 "AUTO OPN. >> MAIN" Window .................................. 3- 9
1.3.4 Work during Automatic Operation .................................. 3- 11
1.4 End of Automatic Operation .................................................... 3- 12
1.4.1 Stop of Automatic Operation .......................................... 3- 12
1.4.2 Logout ............................................................................ 3- 13
2. Squeegee Replacement and Solder Paste Replenishment ........... 3-
14
2.1 When "Squeegee Limit" is reached: ....................................... 3- 14
2.2 Solder Paste Replenishment
during the Automatic Operation ................................... 3- 16
3. PCB Replenishment ....................................................................... 3- 18
3.1 Preparation for PCB's ............................................................. 3- 19
4. Automatic Operation Stop, Interruption and Re-Start .................... 3- 20
4.1 Automatic Operation Stop ....................................................... 3- 20
4.1.1 Temporary Stop (Pause) with [STOP] Button ................ 3- 20
4.1.2 Stop using the Stop Mode ............................................. 3- 20
4.2 Interruption of Automatic Operation ........................................ 3- 21
4.3 Automatic Operation Re-Start ................................................. 3- 21
5. Running-In Operation ..................................................................... 3- 22
Contents
Page
1OM-1505
Cont-51002-002
Chapter 4 Program Change Operation
1. Outline of Program Change Operation ........................................... 4- 1
2. Preparation for Program Change Operation .................................. 4- 2
2.1 Preparation of PCB Backup Jig or PCB Vacuum Jig .............. 4- 2
2.2 Stencil Preparation ................................................................. 4- 2
2.3 Creation of Pattern Program for Production Model ................. 4- 2
2.4 Registration of Pattern Program for Production Model ........... 4- 2
3. Program Change Operation ........................................................... 4- 3
3.1 Selection of Run Mode ........................................................... 4- 3
3.2 Selection of Production Model ................................................ 4- 4
3.3 SET-UP ................................................................................... 4- 5
3.4 Backup Pin Adjustment and PCB Backup Jig or
PCB Vacuum Jig Installation .......... 4- 6
3.4.1 In the case that the Backup Pins are used: ................... 4- 6
3.4.2 In the case that the PCB Backup Jig or
PCB Vacuum Jig is used: .............. 4- 6
3.4.3 In the case that other jig is used: ................................... 4- 7
3.5 PEC Recognition T
est ............................................................. 4- 8
3.6
2 Camera AUTO Calibration ................................................... 4- 8
3.7 Squeegee Attachment ............................................................ 4- 9
3.8 Stencil Attachment .................................................................. 4- 11
3.9 Stencil Recognition Test.......................................................... 4- 17
3.10 Stencil Recognition ................................................................. 4- 17
3.11 Inaccurate Position Correction ................................................ 4- 17
3.12 Solder Paste Replenishment .................................................. 4- 17
3.13 Paste Kneading ...................................................................... 4- 18
4. Test Print and Automatic Operation ................................................ 4- 19
4.1 Test Print ................................................................................. 4- 19
4.2 Automatic Operation ............................................................... 4- 19