1OM-1505-004_w - 第50页

Contents Page 1OM-1505 Cont-5 1002-002 Chapter 4 Program Change Operation 1. Outline of Program Change Operation ........................................... 4- 1 2. Preparation for Program Change Operation ..............…

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Contents
Page
1OM-1505
Cont-41002-002
Chapter 3 Outline of Automatic Operation
1. Automatic Operation ...................................................................... 3- 1
1.1 Inspections before Automatic Operation ................................. 3- 2
1.1.1 Conrmation of Power Supply ....................................... 3- 2
1.1.2 Conrmation of Air Pressure .......................................... 3- 2
1.1.3 Cover Section Check ..................................................... 3- 3
1.1.4 Safety Check for Surrounding Area of the Machine ...... 3- 4
1.2 Preparation before Operation ................................................. 3- 5
1.2.1 Power Input ................................................................... 3- 5
1.2.2 Preparation for Solder Paste ......................................... 3- 6
1.3 Start of Automatic Operation ................................................... 3- 7
1.3.1 Starting the System Program ........................................ 3- 7
1.3.2 Login Operation ............................................................. 3- 8
1.3.3 "AUTO OPN. >> MAIN" Window .................................. 3- 9
1.3.4 Work during Automatic Operation .................................. 3- 11
1.4 End of Automatic Operation .................................................... 3- 12
1.4.1 Stop of Automatic Operation .......................................... 3- 12
1.4.2 Logout ............................................................................ 3- 13
2. Squeegee Replacement and Solder Paste Replenishment ........... 3-
14
2.1 When "Squeegee Limit" is reached: ....................................... 3- 14
2.2 Solder Paste Replenishment
during the Automatic Operation ................................... 3- 16
3. PCB Replenishment ....................................................................... 3- 18
3.1 Preparation for PCB's ............................................................. 3- 19
4. Automatic Operation Stop, Interruption and Re-Start .................... 3- 20
4.1 Automatic Operation Stop ....................................................... 3- 20
4.1.1 Temporary Stop (Pause) with [STOP] Button ................ 3- 20
4.1.2 Stop using the Stop Mode ............................................. 3- 20
4.2 Interruption of Automatic Operation ........................................ 3- 21
4.3 Automatic Operation Re-Start ................................................. 3- 21
5. Running-In Operation ..................................................................... 3- 22
Contents
Page
1OM-1505
Cont-51002-002
Chapter 4 Program Change Operation
1. Outline of Program Change Operation ........................................... 4- 1
2. Preparation for Program Change Operation .................................. 4- 2
2.1 Preparation of PCB Backup Jig or PCB Vacuum Jig .............. 4- 2
2.2 Stencil Preparation ................................................................. 4- 2
2.3 Creation of Pattern Program for Production Model ................. 4- 2
2.4 Registration of Pattern Program for Production Model ........... 4- 2
3. Program Change Operation ........................................................... 4- 3
3.1 Selection of Run Mode ........................................................... 4- 3
3.2 Selection of Production Model ................................................ 4- 4
3.3 SET-UP ................................................................................... 4- 5
3.4 Backup Pin Adjustment and PCB Backup Jig or
PCB Vacuum Jig Installation .......... 4- 6
3.4.1 In the case that the Backup Pins are used: ................... 4- 6
3.4.2 In the case that the PCB Backup Jig or
PCB Vacuum Jig is used: .............. 4- 6
3.4.3 In the case that other jig is used: ................................... 4- 7
3.5 PEC Recognition T
est ............................................................. 4- 8
3.6
2 Camera AUTO Calibration ................................................... 4- 8
3.7 Squeegee Attachment ............................................................ 4- 9
3.8 Stencil Attachment .................................................................. 4- 11
3.9 Stencil Recognition Test.......................................................... 4- 17
3.10 Stencil Recognition ................................................................. 4- 17
3.11 Inaccurate Position Correction ................................................ 4- 17
3.12 Solder Paste Replenishment .................................................. 4- 17
3.13 Paste Kneading ...................................................................... 4- 18
4. Test Print and Automatic Operation ................................................ 4- 19
4.1 Test Print ................................................................................. 4- 19
4.2 Automatic Operation ............................................................... 4- 19
Contents
Page
1OM-1505
Cont-61103-003
Chapter 5 Basic Information
1. Specications ................................................................................. 5- 1
1.1 Specications of SIGMA-P4 Screen printer ............................ 5- 1
1.2 Standard Accessory Parts List ............................................... 5- 14
2. Option ............................................................................................. 5- 15
2.1 Squeegee Holder .................................................................... 5- 15
2.2 Squeegee ............................................................................... 5- 15
2.3 CLEANING PAPER HOLDER................................................. 5- 15
2.4 CLEANING PAPER................................................................. 5- 15
3. Specications of Printing Stencil Plate Making .............................. 5- 16
4. Fiducial Marks ................................................................................ 5- 26
5. Measured Noise Value ................................................................... 5- 29
Chapter 6 Accompanying Materials
1. Specications of Backup Jig Making .............................................. 6- 1
2. Assembling Table ........................................................................... 6- 2
3. PCB Backup Jig (PCB Width W "250<=W<=460") ........................ 6- 3
3.1 Dimension Table ..................................................................... 6- 3
3.2 Assembly Diagram .................................................................. 6- 4
3.3 Variant Drawing for the Component Section (P/N 21-1). ....... 6- 5
3.4 Variant Drawing for the Component Section (P/N 21-2). ........ 6- 6
3.5 Variant Drawing for the Component Section (P/N 21-3). ........ 6- 7
4. PCB Backup Jig (PCB Width W "65<=W<250") ............................. 6- 8
4.1 Dimension Table ..................................................................... 6- 8
4.2 Assembly Diagram .................................................................. 6- 9
4.3 Variant Drawing for the Component Section (P/N 22-1). ........ 6- 10
4.4 Variant Drawing for the Component Section (P/N 22-2). ........ 6- 11
4.5 Variant Drawing for the Component Section (P/N 22-3). ........ 6- 12
5. PCB Backup Jig (PCB Width W "50<=W<65") ............................... 6- 13
5.1 Dimension Table ..................................................................... 6- 13
5.2 Assembly Diagram .................................................................. 6- 14
5.3 Variant Drawing for the Component Section (P/N 23-1). ........ 6- 15
5.4 Variant Drawing for the Component Section (P/N 23-2). ........ 6- 16