1OM-1505-004_w - 第74页
1OM-1505 3. Mechanism for Screen Printing : Chap.1 1-19 3.5 Items Required for Printing • Solder Paste Solder Paste F1A22 This is creamy solder made from mixture of solder powder and flux solvent. Note (a) Carefully read …
1OM-1505
1-18
3. Mechanism for Screen Printing : Chap.1
3.4 Cleaning Section
Supply Roller
Take-Up Roller
F1A20
This unit is used to automatically clean the lower surface of the stencil.
Cleaning Section
F1A21
1002-002
1OM-1505
3. Mechanism for Screen Printing : Chap.1
1-19
3.5 Items Required for Printing
•
Solder Paste
Solder Paste
F1A22
This is creamy solder made from mixture of solder powder and flux solvent.
Note
(a) Carefully read the specications of the solder paste and the precautions on
handling it for the correct use.
(b) Do not mix new solder paste with old one.
•
Squeegee
Solder Paste
Squeegee
Stencil
PCB
F1A23
The squeegee is used to apply solder paste to the PCB through the pores of the
stencil mesh, forming printed patterns on the PCB.
•
Stencil
F1A24
The stencil is used to print solder paste on the PCB through the pores of the stencil
mesh.
0906-001
1OM-1505
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4. Screen Printing Procedure : Chap.1
0906-001
4. Screen Printing Procedure
The procedure for printing the PCB is described briefly.
PCB Input and Positioning 4.1
PEC Recognition 4.2
Printing 4.3
PCB Output 4.4
Printing Flow Chart F1A25