Products_Overview_EN_CN - 第9页
TECHNOLOGY BENEFIT S 技术优势 › Oxide and void-free joint surface between chip and interconnected device › Integrated or separate oxidation and deoxidation processes › Simple proling and fast heating and cooling rates › Ass…
Nexus
Void free soldering with vacuum
Perfect for different applications
完美适配多种应用的真空接触式焊接系统
Reliable vacuum processes for improved quality
The vacuum soldering process generates tempera-
tures of up to 400 °C and is an ideal solution for void-
free and flux-free applications. The Nexus not only
provides your manufacturing operation with advanta-
ges for the soldering process, but rather for bonding
processes as well.
可靠的真空工艺有效提升焊接质量
Nexus 真空接触式焊接系统， 焊接温度可高达400℃， 是满
足无空洞及无助焊剂应用需求的理想型解决方案。在生产应
用方面，Nexus不仅具备焊接制程上的优势，还同样适用于
胶粘工艺制程。
Without vacuum
非真空制程
With vacuum
真空制程
Up to
400 °C
TECHNOLOGY BENEFITS
技术优势
› Oxide and void-free joint surface between chip and interconnected device
› Integrated or separate oxidation and deoxidation processes
› Simple proling and fast heating and cooling rates
› Assembly under high level of vacuum
› Integration of drying and degassing processes
› Optimum dispersal of waste heat
Nexus
Contact Soldering
The Nexus system guarantees high-quality results with a reflow process using con-
tact heat in a vacuum. It thus meets the highest requirements of power electronics, in
the advanced packaging and semi-conductor area.
The Nexus contact soldering system is best suited for void-free soldering of different
devices (e.g. IGBT) on DCB substrates. The combining of materials that are normally
highly dissimilar takes place in the vacuum at a reduced pressure at temperatures up
to 400 °C. The reduced pressure thereby helps to minimise oxidation on the com-
ponents and on the solder itself. The transfer of heat is via heat contact surfaces or
optional by radiation. The Nexus system is predominantly used in small and medium
production lines as well as in the eld of laboratory.
Nexus在真空环境下采用接触式回流焊接工艺，能够确保高质量的焊接成果。因此它能够满足电力电
子产品的先进封装以及半导体应用领域的最高要求。
接触式焊接系统最适合用于在DCB基板上对不同组件（例如IGBT）进行无空洞焊接。性质迥异的材料
在低压真空且温度高达400℃的环境下相结合，有效降低了部件和焊料自身的氧化反应。Nexus系统可
以通过表面接触或者辐射方式进行热传导，主要应用于中小型生产线以及实验室领域。
Nexus Contact Soldering
芯片与基板之间焊点无氧化且无空洞
集成或分离式清洁及除垢工艺
简化建模和提升加热及冷却速率
高度真空的装配环境
集成式干燥和除气工艺
更优化的散热
TECHNOLOGY BENEFITS
技术优势
› Analysis of resistance of sensitive electronics in extreme temperatures
› Optimal combinations of systems with other measuring equipment
› Excellent insulation values due to foamed housing
› Excellent heating or cooling capacity
› Easy access and minimal maintenance
› Systems available as stand-alone or in-line variant
Securo Plus
System for
hot function test
高温耐受性测试系统
Securo Minus
System for
cold function test
低温耐受性测试系统
极端温度条件下分析电子元件的耐受性能
与其他检测设备高度兼容，优化组合成多样化检测系统
采用隔热性更为优良的发泡隔热层
出色的加热或冷却性能
易于操作，最低维护需求
可用做批处理或嵌入式处理系统