SM481_Service Manual - 第30页

设备规 格及名 称 7 BGA , CSP □ 42m m 以下 , B all pitch 1.0mm 以上 SECTION ITEM SPECIFICATION REMARK Genera l Place mentA ccuracy Chip 040 2 X,Y : ± 0.05 mm, θ : ± 5.0 0 ° , Cpk ≥ 1.0 Chip 060 3 X,Y : ± 0.08 mm, θ : ± 5.0 0 ° , Cpk…

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Advanced High Speed Flexible Mounter
6
2.3. Detail Specifications of the Machine
SECTION ITEM SPECIFICATION REMARK
General
Tact time
Under optimum
condition
0.095 seconds/component, Chip1608
(38,000 cph)
同时吸附基准, Flying vision
Component dump rate
1,000 ppm 以下, Chip1005 本公司选定的零件
2,000 ppm 以下, Chip0603 本公司选定的零件
SECTION
ITEM
SPECIFICATION
REMARK
General
Component
types
Flying vision
MEGA
FOV 24 mm
Chip
0402~□16 mm
□8 mm 以下: 支持所有贴装头
□8 mm 超过: 支持 H1, H3, H5, H7, H9
IC, Connector
□16 mm 以下, Lead pitch 0.4 mm 以上
BGA, CSP
□
16 mm
以下
, Ball pitch 0.4 mm
以上
Maximum height
Flying vision
10 mm
Upward vision
15 mm
SECTION
ITEM
SPECIFICATION
REMARK
General
Component
types
Upward vision
MEGA
FOV 35 mm
IC, Connector
□32 mm 以下, Lead pitch 0.3 mm 以上
□32 ~ □42 mm 分割识别
(Ball pitch 1.0 mm 以上, Lead pitch 0.5 mm 以上)
□42 ~ □55 mm 분할인식
(Ball pitch 1.0 mm 以上, Lead pitch 0.65 mm 以上)
BGA, CSP
□32 mm 以下, Ball pitch 0.5 mm 以上
Upward vision
MEGA
FOV 45 mm
IC, Connector
□42 mm 以下, Lead pitch 0.4 mm 以上
BGA, CSP
□42 mm 以下, Ball pitch 1.0 mm 以上
Upward vision
FOV 35 mm
IC, Connector
□32mm 以下, Lead pitch 0.4mm 以上
□32 ~ □42 mm 分割识别
(Ball pitch 1.0 mm 以上, Lead pitch 0.5 mm 以上)
□42 ~ □55 mm 分割识别
(Ball pitch 1.0 mm 以上, Lead pitch 0.65 mm 以上)
BGA, CSP
□32mm 以下, Ball pitch 0.75mm 以上
Upward vision
FOV 45 mm
IC, Connector
□42mm 以下, Lead pitch 0.5mm 以上
设备规格及名称
7
BGA, CSP
□42mm 以下, Ball pitch 1.0mm 以上
SECTION ITEM SPECIFICATION REMARK
General PlacementAccuracy
Chip 0402
X,Y : ±0.05 mm, θ : ±5.00 °, Cpk≥1.0
Chip 0603
X,Y : ±0.08 mm, θ : ±5.00 °, Cpk≥1.0,
Chip 1005
X,Y : ±0.10 mm, θ : ±5.00 °, Cpk≥1.0
Lead IC 0.4 Pitch
X,Y : ±0.05 mm, θ : ±0.30 °, Cpk≥1.0
CSP Ball 0.4 Pitch
X,Y : ±0.05 mm, θ : ±0.30 °, Cpk≥1.0
SECTION ITEM SPECIFICATION REMARK
Fiducial
vision
Function Component teaching, Fiducial inspection
Camera type Analog 640 X 480 pixel, C-mount
Configuration
1 Camera@Head FOV 7.5 mm x 1 Set 1 Camera@ 1 Head (Right side)
2 Camera@Head FOV 7.5 mm x 2 Set 2 Camera@ 1 Head
Illumination
Light source LED -
Light adjustment 16 Level
256 Level light mapping → 16 Level
Light control
Programmable, 2 种(Outer light, Coaxial light)
Flying
vision
Function Component inspection
Mega
Camera type Analog 1360 X 1040 pixel, C-mount
Configuration
FDV 24 mm × 5 个 x 2 Gantry
Illumination Light source LED
Advanced High Speed Flexible Mounter
8
Light adjustment 16 Level
256 Level light mapping → 16 Level
Light control
Programmable, 3 种(Outer light, Side light, Coaxial
light)
SECTION
ITEM
SPECIFICATION
REMARK
Upward
vision
Function Component inspection, System calibration
Camera type
Analog 1360 X 1040 pixel, C-mount
Configuration
Mega FOV 35 mm
最多可以安装 2 Unit
Mega FOV 45 mm
Non-Mega FOV 35 mm
Non-Mega FOV 45 mm
Illumination
Light source LED
Light adjustment 16 Level
4096 Level light mapping → 16 Level
Light control
Programmable, 3 种(Inner light, Outer light, Side
light)
Vision
board
Board Analog camera grabber
(NAIM TECH)SAMCME 1EA, Mega 相机
PCBs
supported
Maximum board size
L460 X W400 mm
L510 X W460 mm
L610 X W460 mm
L610 X W510 mm
L660 X W460 mm
L740 X W460 mm(Left to Right)
Stopper 移动及出入口延长,
Not use Side Tray(STF-100S)
L740 X W460 mm(Right to Left)
Minimum board size
L50 X W40 mm
适用 SM series in-line spec.
L50 X W30 mm
Board thickness
0.38 ~ 4.2 mm
Maximum board weight
2kg
Maximum board size L740 X W460
时适用
3kg