Brochure-PI-BAT_EN-Rev5-12-2017_LD - 第6页
Specifications Inspection technology 3D engine Camera Image resolution Projection Field of View (X x Y) Lighting High speed frame grabber Warp compensa tion Z-r eference 360° Moiré – Shadow free, Multi-camera, Multi-proje…
Inspektion mit eindeutigem Ziel Ziel Ziel
Inspect with a purpose
Control the print process to increase yield
Improve your process and set tolerances independently
of products with automatic pad grouping by AAR (Area
Aperture Ratio)
Understand your process with an extra-large review
image in textured 3D for easy diagnostic.
PI’s automatic pad grouping by AAR is just one the many features targeted
specically at process control. Combined with SIGMA Link software suite,
inspection data becomes actionable process information.
Monitor your process in real-time with SIGMA
Analysis - O-line SPC - or simply with PI’s
embedded SPC.
Specifications
Inspection technology
3D engine
Camera
Image resolution
Projection
Field of View (X x Y)
Lighting
High speed frame grabber
Warp compensation
Z-reference
360° Moiré – Shadow free, Multi-camera, Multi-projector, Multi-pattern
80 Mpixel, 12-bit CMOS sensor 160 Mpixel, 12-bit CMOS sensor
15 µm
4 HD, 10 bit Industrial projectors 8 HD, 10 bit Industrial projectors
160 mm x 55 mm 350 mm x 55 mm
White LED + RGB lighting
Up to 30 Gbit/s
+/- 5 mm with patended dual Z axis motion for real time Z and tilt adjustments
Full PCB inspection for Z-referencing with no cropping around pads
Inspection performance
Measurements
Defect types
Maximum paste size
Minimum paste size
Maximum paste height
Height resolution
Height accuracy
Height repeatability
Volume repeatability
Gage R&R
Cycle time
Height, Area, Volume, Offset, Bridging, Shape 2D, Shape 3D, Coplanarity
Insufficient / Excessive / Missing paste, Bridge, Shape 2D, Shape 3D, user defined defects
20 mm x 20 mm
150 µm x 150 µm
400 µm (consult us for higher paste height)
100 nm
<< 1 µm on Certification target at operating temperature
<< 1 µm @ 3 σ on Certification target at operating temperature
< 3% @ 3 σ on PCB at operating temperature
<< 10%
3 sec per Ultra-large FOV + 2.5 sec (load/unload)
Offline programming software
Online SPC
(Statistical Process Control)
Offline SPC
SIGMA Import (Gerber & CAD data)
Histograms, X-R charts, Signature, Cp/Cpk, Gage R&R
SIGMA Analysis (Web-based software)
Options
External barcode reader (1D/2D)
Internal barcode reader (1D/2D)
Closed loop to printers
Others
Cognex DM 150 (requires 1 000 mm conveyor)
Yes
With all major printers
Consult us
Interface
Power requirements
Dimensions (W x D x H)
Weight
Operating temperature
Relative humidity
IPC-SMEMA-9851
Single Phase 2P+ Earth, 100 - 240 VAC / 16A, no need for compressed air
1 000 mm (Option 800 mm) x 1 296 mm x 1 647 mm
430 kg
15°C to 30°C
20 – 75% (without condensing)
Regulatory compliance
Norms and standards
CE (European Safety Requirements), IEC 60204, IEC 61010-1, IEC 60950, IEC 61000-2-2
System
Operating system
Processor
Storage capacity
Massive parallel computing
Motion control
Linux
Xeon E5-2620 v3 6-core 12-threads, 48GB Memory
6 TB, including 4 TB in RAID1
3.2 Teraflops, 1 593 - Core 6.4 Teraflops, 3 186 - Core
Linear optical encoder (1 µm resolution)
Front view Side view
Specifications
PI PICO / PI PRIMO
PI PRIMO
PCB handling
Minimun PCB dimensions (L x W)
PCB thickness
Minimum edge clearance
Top clearance
Bottom clearance
Conveying direction
50 mm x 50 mm (2 x 2 inch)
0.1 mm to 5
.0 mm
3 mm
20 mm
50 mm
Left to right - Right to left - Left to left - Right to right
S M XL
Maximum PCB dimensions (L x W)
Conveying height
Conveyor lenght
Maximum PCB weight
350 x 533 mm (14 x 21 inch) 533 x 533 mm (21 x 21 inch) 609 x 533 mm (24 x 21 inch) 762 x 533 mm (30 x 21 inch)
1250 mm
4,5 kg
830 mm to 930 mm (Standard) / 900 mm to 1000 mm (Option)
Robust design
Embedded guide
Easy maintenance
1000 mm (800 mm option)
1000 mm
4 kg
1000 mm