00198371-01_UM_SWS-EN - 第106页

6 Options User manual SIPLACE Wafer System (SWS) 6.1 Nozzle changer Edition 04/2018 106 6 PLEASE NOTE Stop if magazi nes missi ng The safety cutoff of the SIPLACE CA4 V2 triggers if magazines are missing or incorrectly f…

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User manual SIPLACE Wafer System (SWS) 6 Options
Edition 04/2018 6.1 Nozzle changer
105
6 Options
For the relevant configurations and other options, refer to the individual specifications.
6.1 Nozzle changer
Depending on the configuration of the placement heads on the SIPLACE CA4 V2, there may be
a nozzle changer attached to the SWS when it is used. The main difference between the nozzle
changers at an SWS and those at locations without SWS lies in the usage of a different reject bin
(03070917-01). The nozzle changers for the SWS are structured alike, the only difference is the
mirror-inversed position of the reject bins at the left-hand locations (1 and 3) and the right-hand
locations (2 and 4). Two rows of nozzle changers can be fitted to the SWS.
6.1.1 Position of nozzle changers - example
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Fig. 6.1 - 1 Nozzle changer on the SWS - example
(1) Nozzle changer configuration (example)
(2) Component reject bin
1
2
6 Options User manual SIPLACE Wafer System (SWS)
6.1 Nozzle changer Edition 04/2018
106
6
PLEASE NOTE
Stop if magazines missing
The safety cutoff of the SIPLACE CA4 V2 triggers if magazines are missing or incorrectly
fitted. The SWS emergency STOP is triggered.
Use all magazine places.
User manual SIPLACE Wafer System (SWS) 6 Options
Edition 04/2018 6.2 Optional components
107
6.2 Optional components
6.2.1 Linear Dipping Unit (LDU SWS)
6
Fig. 6.2 - 1 Linear Dipping Unit (LDU SWS)
The Linear Dipping Unit (LDU SWS, Linear Dipping Unit) is often needed, to apply flux to the die
during the flip chip process.
The LDU SWS is able to apply highly accurate layers of flux. This flux is made available in a so-
called cavity. The depth of the cavity determines the thickness of the flux layer.
6
6
PLEASE NOTE
The LDU SWS must be provided for all types of suitable flip chip fluxes.
Only use epoxide and solder pastes after internal factory tests have been performed.
PLEASE NOTE
The LDU SWS can NOT be used together with the die attach unit.