00198371-01_UM_SWS-EN - 第107页
User manual SIPLACE Wafer System (SWS) 6 Options Edition 04/2018 6.2 Optional components 107 6.2 Optional component s 6.2.1 Linear Dipping Unit (LDU SWS) 6 Fig. 6.2 - 1 Linear Dipping Unit (LDU SWS) The Linear Dipping Un…
6 Options User manual SIPLACE Wafer System (SWS)
6.1 Nozzle changer Edition 04/2018
106
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PLEASE NOTE
Stop if magazines missing
The safety cutoff of the SIPLACE CA4 V2 triggers if magazines are missing or incorrectly
fitted. The SWS emergency STOP is triggered.
Use all magazine places.
User manual SIPLACE Wafer System (SWS) 6 Options
Edition 04/2018 6.2 Optional components
107
6.2 Optional components
6.2.1 Linear Dipping Unit (LDU SWS)
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Fig. 6.2 - 1 Linear Dipping Unit (LDU SWS)
The Linear Dipping Unit (LDU SWS, Linear Dipping Unit) is often needed, to apply flux to the die
during the flip chip process.
The LDU SWS is able to apply highly accurate layers of flux. This flux is made available in a so-
called cavity. The depth of the cavity determines the thickness of the flux layer.
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6
PLEASE NOTE
The LDU SWS must be provided for all types of suitable flip chip fluxes.
Only use epoxide and solder pastes after internal factory tests have been performed.
PLEASE NOTE
The LDU SWS can NOT be used together with the die attach unit.
6 Options User manual SIPLACE Wafer System (SWS)
6.2 Optional components Edition 04/2018
108
6.2.2 Die attach unit
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Fig. 6.2 - 2 Die attach unit
(1) Drive motor for rotating the die attach axis
(2) Driver for X axis transfer
(3) Motor transfer X axis
The die attach unit is needed for die attach mode.
The flip unit transfers the die to the die attach unit. The die is then rotated accordingly there and
made available for pickup. The die is therefore made available to the placement head in the same
top/bottom orientation as it was on the wafer and is placed in this position.
In die attach mode, only segment 1 of the flip unit functions. The flip unit takes up the next die,
while the current die is being picked up by the placement head from the die attach unit.
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PLEASE NOTE
The die attach unit can NOT be used together with the LDU SWS.
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