00198371-01_UM_SWS-EN - 第17页
User manual SIPLACE Wafer System (SWS) 1 Introduction Edition 04/2018 1.2 Description of functions 17 1.2.2 Basic SWS Functions The main die handling components are the wafer t able, the magazine lift, the ejection syste…
1 Introduction User manual SIPLACE Wafer System (SWS)
1.2 Description of functions Edition 04/2018
16
1.2 Description of functions
1.2.1 SIPLACE Wafer System (SWS) function
The new SWS provides a fully automatic wafer and chip handling system. It is fully integrated into
a SIPLACE CA4 V2 location. Each location can (with restrictions) be fitted with an SWS or with
an X table.
The SWS functions like a feeder for the SIPLACE system and transports the dies from the wafer
to a single, fixed pickup position for the placement head. The placement head picks the die up
from the SWS and places this on the board as done during SMD handling.
The SWS appears in SIPLACE Pro like an X table with a special feeder type. The programming
of this is the same as that for the SIPLACE CA4 V2. Die handling is programmed at a separate
terminal on the SWS. The main parameters to be programmed are as follows:
– Magazine type
– Wafer frame type
– Wafer and die dimensions
– Die recognition
– Die ejection parameters
– Link to SIPLACE Pro
User manual SIPLACE Wafer System (SWS) 1 Introduction
Edition 04/2018 1.2 Description of functions
17
1.2.2 Basic SWS Functions
The main die handling components are the wafer table, the magazine lift, the ejection system, the
flip unit and the control unit with corresponding SWS software.
The wafer with the relevant die is loaded from the magazine and fixed onto the wafer table. The
wafer table places the die using the ejector system, which releases the die from the wafer foil, and
transfers it to the flip unit.
The flip unit then processes this using two different functions:
– The flip unit rotates the die by 180° and makes this available for pickup by the placement
head.
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– The flip unit transfers it to the die attach unit. The placement head approaches this and the
die is placed on the board in the same position as it was on the wafer.
The SIPLACE CA4 V2 uses a high precision SIPLACE placement head which has been specifi-
cally selected for maximum accuracy and fulfillment of all requirements in normal and restricted
conditions (see "Scope of delivery and services" for details of restrictions).
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The following options are available to support the whole spectrum of process-oriented functions:
– Linear dipping unit
– Die attach unit
– Barcode scanner
– Wafer stretcher
– Inspection camera
PLEASE NOTE
All movable positioning axes in the SWS are servo axes!
1 Introduction User manual SIPLACE Wafer System (SWS)
1.2 Description of functions Edition 04/2018
18
1.2.3 Basic die presentation process
The basic die presentation process supported by the SWS can be divided into 3 main steps:
– Die recognition and positioning for ejection (inc. inkspot recognition)
– Ejection process
– Die attach or flip chip process.
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Fig. 1.2 - 1 Basic die presentation process (basic principle)
There are two main ways to process dies:
– Flip chip process
– Die attach process