00198371-01_UM_SWS-EN - 第64页
3 Technical data and assemblies User manual SIPLACE Wafer System (SWS) 3.2 Ambient conditions and connection values Edition 04/2018 64 3.2.5.1 Overview of dimens ions 3 Fig. 3.2 - 1 Overview of measurements - SIPLACE Waf…
User manual SIPLACE Wafer System (SWS) 3 Technical data and assemblies
Edition 04/2018 3.2 Ambient conditions and connection values
63
3.2.4 Compressed air specification
3
3.2.5 Dimensions and weight
3
Compressed air supply
Compressed air pressure values
p
min
p
max
0.5 MPa = 5.0 bar
1.0 MPa = 10 bar
Operating pressure 0.48 MPa ± 0.025 MPa (4.8 bar ± 0.25 bar)
Compressed air connection Plastic hose PUN 6 to SIPLACE CA4 V2.
Compressed air specification
Particle size 0.1 µm
Particle density 0.1 mg/m³
Maximum oil content (class 1) Particle density 0.01 mg/m³
Pressure dewpoint (class 4) Dewpoint + 3°
Length 1650 mm
Width 650 mm
Height of SWS
With open sliding door
1479 mm
1940 mm at PCB conveyor height 930 mm (default)
1910 mm at PCB conveyor height 900 mm (option)
1960 mm at PCB conveyor height 950 mm (SMEMA)
Weight
Without magazine 350 kg
3 Technical data and assemblies User manual SIPLACE Wafer System (SWS)
3.2 Ambient conditions and connection values Edition 04/2018
64
3.2.5.1 Overview of dimensions
3
Fig. 3.2 - 1 Overview of measurements - SIPLACE Wafer System
(1) 1650 mm
(2) 650 mm
(3) 1479 mm
(4) 510 mm
User manual SIPLACE Wafer System (SWS) 3 Technical data and assemblies
Edition 04/2018 3.2 Ambient conditions and connection values
65
3.2.6 Center of gravity for SWS
3
Fig. 3.2 - 2 Center of gravity for SWS
3
Center of gravity coordinates:
SWS X coordinate
Y coordinate
0 mm
650 mm