00198371-01_UM_SWS-EN - 第8页
Contents User manual SIPLACE Wafer System (SWS) Edition 04/2018 8
User manual SIPLACE Wafer System (SWS) Contents
Edition 04/2018
7
6 Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
6.1 Nozzle changer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
6.1.1 Position of nozzle changers - example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
6.2 Optional components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
6.2.1 Linear Dipping Unit (LDU SWS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
6.2.2 Die attach unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
6.2.3 Barcode scanner . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
6.3 SWS wafer stretcher (expander) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111
6.3.1 Safety instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
6.3.2 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
6.3.3 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
6.3.4 Setting the stretching height mechanically. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
6.3.4.1 Preparations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
6.3.4.2 Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
6.3.5 Setting the frame width for 8" wafer supports . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
6.3.5.1 Preparations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
6.3.5.2 Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
6.3.6 Converting the SWS wafer stretcher (expander) . . . . . . . . . . . . . . . . . . . . . . . . . 120
6.3.6.1 Parts in the 12" wafer expander retrofit kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
6.3.6.2 Preparations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
6.3.6.3 Removing the 8" wafer support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
6.3.6.4 Differences in conversion from 12" to 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
7 Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Contents User manual SIPLACE Wafer System (SWS)
Edition 04/2018
8
User manual SIPLACE Wafer System (SWS) 1 Introduction
Edition 04/2018
9
1 Introduction
This user manual is a guide or reference work for operating and setting up the SIPLACE
®
Wafer
System (SWS).
This document is the original user manual.
The SIPLACE Wafer System (SWS) supplies the placement head of the SIPLACE CA4 V2 with
components (bare dies) directly from the wafer.
The wafer is fed in fully automatically from the wafer magazine and the components can then be
processed by the SIPLACE CA4 V2, using the customary placement procedure.
Flip chip process - function
The wafers are transported fully automatically from the wafer magazine to the wafer table. This
then positions the die concerned over the ejection system, which releases the die from the wafer
foil. After this release procedure, the flip unit nozzle takes the die, rotates it by 180° and makes it
available to the placement head for pickup.
The process spectrum is supplemented by the options:
– Die attach unit:
The die attach unit takes the die from the flip unit nozzle and turns it, so that it has the same
top-bottom orientation on the board as it had on the wafer.
– Linear Dipping Unit
The Linear Dipping Unit distributes precise layers of flux for the flip chip process. After taking
over from the flip unit the placement head dips the die in to the flux layer.
Installation in the SIPLACE CA4 V2
The SWS can be integrated into all four locations of the SIPLACE CA4 V2. There are two different
variants of the SWS:
SWS 12 (1/3) 1
SWS 12 (2/4) 1
SWS 12 (1/3) can be fitted to locations 1 and 3; SWS 12 (2/4) can be fitted to locations 2 and
4. 1