Edison - 第2页
Faster Throughput for a Better Process Edison’s new parallel processing system is extremely fast resulting in a very short cycle time. This helps increase throughput by shortening total time per PCB printed. This leaves …
Electronic Assembly Equipment
Edison
Printing System
Unparalleled
throughput and
accuracy in an
advanced next-
generation scalable
printer platform.
Outstanding speed, accuracy and performance
surpassing best-in-class SMT printers worldwide.
Faster Throughput for a Better Process
Edison’s new parallel processing system is extremely fast resulting in a very
short cycle time. This helps increase throughput by shortening total time per
PCB printed. This leaves more time for key overhead functions that have the
biggest impact on print quality:
• Print at slower speeds to decrease variability
• Utilize slow stencil separation for optimal print definition
• Double stroke after wipe
• More frequent wiping resulting in higher yields
• Time leftover to optimize settings
for maximum possible yields
Unmatched Speed, Accuracy, and Capability
Edison delivers an unheard-of higher throughput than competitive printers
–15 seconds total throughput, including print and stencil wipe cycles. That’s
because individual print process
cycle times have been significantly
reduced, when possible by design,
for a cumulative time savings.
For Accuracy, Edison has no equal.
Edison has built-in ±8 micron
alignment, and ±15 micron wet
print repeatability (≥2 Cpk @ 6
sigma) proven through 3rd party
Print Capability Analysis (PCA)
testing. This represents a 25%
improvement in wet print accuracy
over current best-in-class printing
machines.
Machine Capability Analysis (MCA) confirms printer performance in term of
accuracy and stability using specific tools. Manufacturer specifications are used to
qualify the equipment. MCA, tested using a dedicated glass plate testing fixture
guarantees that machine performance is within the manufacturer’s specifications.
Edison
Back To Back (BTB) Configurable
BTB is a flexible dual lane solution
without adding line length; identical
single-lane printers are easily re-deployed
to other lines when needed. Use in BTB
configuration, or singly as a stand-alone.
Edison is an innovative
printer with a scalable set
of software, controls, and
advanced technologies.
Ideally suited for the
demanding Automotive,
Semiconductor and Smart
Device manufacturing
markets, Edison is built
to excel in every way,
with patented features
throughout its design.
Edison Delivers
Exceptional
Performance
• Fast: Best-in-class throughput
• Accurate: 25% improvement
in wet print accuracy over
current leading machines
• Fine Pitch Capable: Proven
print process capability greater
than 2 Cpk for 0201 metric
components
Ergonomic “Walk-in” Printer
Walk-in design allows for easy access to tooling
during changeover. All serviceable controls
are also located in the front for easy access.
Compact design minimizes floor space.
Intueri GUI and OpenApps
MPM Intueri is a simple, intuitive operator
interface with a flexible, wide array of
configuration variables. It is combined
with Open Apps for maximum capability
and connectivity and provides a portal to
Industry 4.0 concepts.
High Speed Vision Alignment
with Ultra-slim Camera
Overall Gantry thickness is only 39 mm
featuring ‘on the fly’ ‘POE’ (Power Over
Ethernet) camera; A single CCD split field
provides precision simultaneous up-down
image acquisition; FOV 9.0 x 6.0 mm.
Ultra-fast, High Efficiency
Wiping System
A super-size 65m paper roll allows 10,000
prints per change. Patented paper tension
control provides more effective wiping and a
separate wiping and printing zone prevents
cross contamination.
Advanced Print Head
Single axis closed-loop pressure control for dual squeegee
eliminates front-to-back variation; a single high precision load cell
provides squeegee force,
and a unique algorithm
calibrates out non-linearity,
maintaining the set pressure
across the entire board
surface.
Outstanding Features for Optimum
Performance and Value
Edison
NEW Board Staging
Ability to have three boards in the machine simultaneously,
reduced distance on input
conveyor by pre-loading
the board during the
print process results in
reduced transfer times and
improved cycle time.
NEW EdgeLoc™ II Board Clamping
The EdgeLoc system uses a side snugging technique that removes
the need for top clamps which interfere with the PCB to stencil
contact. The result is optimal gasketing and more volumetrically
consistent edge-to-edge prints. With EdgeLoc II, robust flippers
engage to secure the board across the top edge ensuring board
flatness then move out of the way once the board is firmly gripped
from the side. EdgeLoc+
board clamping can change
between edge and top
clamping simply through
software.
NEW Paste Height Monitor
The Paste Height Monitor is designed to prevent defects caused by
inadequate volumes of paste on the stencil. It combines advanced
software and sensor technology to accurately monitor the paste
bead for volume consistency. Upper and lower limit roll-height
monitoring eliminates
insufficient or excess
paste volumes. It is a non-
contact solution that can
automatically add more paste
to the stencil as it is needed.