KE2020-Instruction-Manual-ver1.30.pdf - 第21页
1 − 12 (1) W hen Five nozz les pick up and place component s simultaneously and center them w ith lase r Small chip component 11,000 components/ hour 0.33 seconds/com ponent) The value above is a rough estimat e calculat…
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1.1.4 Mechanical specifications
(1) Placement accuracy
The following table lists the placement accuracy data for different types of
components. A poorer accuracy results depending on the components that may
have an edge or plastic mold burrs at the area detected with the laser align function,
and that may have a moving part to be detected with respect to the pick port.
Table 1.1.4.1
Unit: mm
Component type KE-2020
MNLA heads
(Laser recognition correction)
Component size 20 or less
FMLA heads
(VCS recognition correction)
Component size 50 or less
Square chip ± 0.08 −
MELF ± 0.1 −
SOT ± 0.15 −
Aluminum
electrolytic capacitor
± 0.3 ± 0.15
SOP ± 0.15 in the right angle direction against
the lead (Burr on one side: 0.15 or less)
±0.2 in the direction parallel to the lead
BOC mark: ± 0.08 in the right angle
direction against the lead
±0.12 in the direction parallel to the lead
PLCC, SOJ ± 0.2 Component positioning mark: ± 0.08
BOC mark: ± 0.1
QFP, TSOP
(Pitch: 0.8 or more)
± 0.12 Component positioning mark: ± 0.04
BOC mark: ± 0.06
QFP, TSOP
(Pitch: 0.65 or
more)
± 0.09 Component positioning mark: ± 0.04
BOC mark: ± 0.06
QFP, TSOP
(Pitch: 0.5 or more)
− ± 0.04,
Only a component positioning mark is
available.
Unidirectional lead
(Pitch: 0.5 or more)
− ± 0.04 in the right angle direction against
the lead
± 0.12 in the direction parallel to the lead
Only a component positioning mark is
available.
Components whose
image is divided,
then recognized.
− Component positioning mark:
± 0.06 in the right angle direction
against the lead
± 0.12 in the direction parallel to the
lead
BOC mark:
± 0.1 in the right angle direction against
the lead
± 0.12 in the direction parallel to the
lead
BGA ± 0.2 Component positioning mark: ± 0.08
BOC mark: ± 0.12
FBGA − ± 0.06,
Only a component positioning mark is
available.
Other large-size
components
± 0.3 −
(2) Placement cycle time
The optimized placement cycle time is shown below. The cycle time required
when a component is placed on a board actually varies depending on the board
size or how many times a nozzle is replaced.
1 − 12
(1) When Five nozzles pick up and place components simultaneously and center
them with laser
Small chip component
11,000 components/hour 0.33 seconds/component)
The value above is a rough estimate calculated on the assumption that five
components are simultaneously picked up and one component are
simultaneously placed on the almost entire area of a 330 mm x 250 mm
board.
(2) Component recognition with the VCS
1,800 components/hour 2.0 seconds/component)
(3) Least input placement angle increment
Programmable placement angle setting unit: 0.05°
(4) Automatic tool changer (ATC)
The ATC can accommodate up to 31 nozzles.
Small nozzle: 29
Large nozzle: 2
(5) Transport rail height
900 mm ± 20 mm
(6) Machine dimensions and weight
W : [KE-2020M] 1300 mm
[KE-2020L] 1300 mm
[KE-2020E] 1300 mm
[KE-2020M] 1400 mm (including PWB transfer unit)
[KE-2020L] 1400 mm (including PWB transfer unit)
[KE-2020E] 1730 mm (including PWB transfer unit)
D : [KE-2020M] 1599mm
[KE-2020L] 1705 mm
[KE-2020E] 1805mm
[KE-2020M] 1784 mm (including keyboard)
[KE-2020L] 1890 mm (including keyboard)
[KE-2020E] 1990 mm (including keyboard)
H : [KE-2020M] 1550 mm
(height of the main unit when the PWB transfer height is 900 mm)
[KE-2020L] 1834 mm
(height of the vision monitor when the PWB transfer height is 900 mm)
[KE-2020E] 2200 mm
(height of the signal tower when the PWB transfer height is 900 mm)
Mass: [KE-2020M] 1410 kg
[KE-2020L] 1510 kg
[KE-2020E] 1530 kg
[
Definition
]
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(7) Air requirements
Air pressure : 0.49 ± 0.05 Mpa
Air consumption : 200 L/min.(ANR)
Dry air : Atmospheric dew point -17°C or lower
(8) Noise level
76dB
(9) Country of manufacturing
Manufactured in Japan
(10) Environmental conditions
Operating
Ambient temperature: +10° C to +35° C
Relative humidity: 50% or less (at 35° C)
90% or less (at 20° C)
Transport and storage
Temperature: -25° C to +70° C
Relative humidity: 20% to 95% (No condensation)
(11) Installation category: Installation category II (IEC664-1)
(12) Pollution degree: Pollution degree II (IEC664-1)