00195722-0102_UM_X-Serie_SR605_EN - 第124页
3 Technical data for the machine User Manual SIPLACE X-Series 3.5 Placement head From software version SR.605.xx 07/2008 EN Edition 124 3.5.1.2 T echnical data 3 3 3 3 3.5.1.3 Sensor for the component reject bin PLEASE N…
User Manual SIPLACE X-Series 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.5 Placement head
123
3.5.1.1 Description
The 20-segment Collect&Place head works on the Collect&Place principle. This means that,
within each cycle, twenty components are picked up by the placement head. At the pick-up and
placement position the component sensor checks that the component is present at the nozzle. On
their way to the placement position the components are optically centered and rotated into the re-
quired placement angle. Finally forced air sets down the component gently and accurately on the
board.
The C&P20A head succeeds in considerably increasing the output of the placement head and
thus of the overall placement machine. The compact construction of the C&P20A head allows very
short cycle times. In this case, the star axis is at an angle to the PCB level. This geometry allows
the segments to be arranged in a very small space.
The CO camera is still integrated into the C&P20A head. This saves additional traveling distances
to external centering cameras. Each segment also has a separate DP drive for rotating the nozzle.
The nozzles are therefore no longer rotated into the correct position at a single head station. They
can be rotated into their placement position at any time and independently of one another.
Each segment has a separate vacuum generator. This greatly reduces the time taken to switch
between vacuum and air kiss. It also allows a vacuum check to be carried out in the holding circuit
for each individual nozzle.
The Z drive for the segments is implemented with a linear motor with linear path measuring sys-
tem, and is thus extremely precise. In the pick-up/placement position, the Z drive moves the seg-
ments up or down in the vertical direction.
3 Technical data for the machine User Manual SIPLACE X-Series
3.5 Placement head From software version SR.605.xx 07/2008 EN Edition
124
3.5.1.2 Technical data
3
3
3
3
3.5.1.3 Sensor for the component reject bin
PLEASE NOTE 3
If a 20-segment Collect&Place head is used, then we recommend that you install the optional
sensor for the component reject bin. (See also Section 6.5, page 431)
Range of components
a
a) Please note that the component range that can be placed is also affected by the pad geometry, the cus-
tomer-specific standards and the packaging tolerances.
01005 to 2220, Melf, SOT, SOD
Component specification
max. height
min. lead pitch
min. lead width
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
4 mm
0.25 mm
0.1 mm
0.4 mm
0.2 mm
0.4 x 0.2 mm²
6 x 6 mm²
1 g
Programmable set-down force, variable increments 1.5 ± 0.5 N
2.0 ± 0.5 N
3.5 ± 1 N
4.5 ± 1 N
Nozzle types 10xx, 11xx, 12xx
X/Y accuracy ± 41 μm/3σ, ± 55 μm/4σ
Angular accuracy ± 0.5°/3σ, ± 0.7°/4σ
Component range 95%
CO camera type 23
Illumination level 5
Possible illumination level settings 256
5
User Manual SIPLACE X-Series 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.5 Placement head
125
3.5.2 12-segment Collect&Place head for high-speed placement
3
Fig. 3.5 - 3 12-segment Collect&Place head - Function groups, part 1
3
(1) Vacuum generator
(2) Turning station, DP axis
(3) Star with 12 sleeves, star axis
(4) Forced air valve
(5) Silencer