00195722-0102_UM_X-Serie_SR605_EN - 第135页
User Manual SIPLACE X-Series 3 Technical data for the machine From software version SR.605.xx 07/2008 EN Edition 3.5 Placement head 135 Programmable set-down force 1.0 N - 15 N 2.0 N - 30 N d 1.0 N - 15 N 2.0 N - 30 N d …
3 Technical data for the machine User Manual SIPLACE X-Series
3.5 Placement head From software version SR.605.xx 07/2008 EN Edition
134
3.5.4.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether (twin head). Both heads work using the Pick&Place principle. The TwinHead is suitable for
processing particularly difficult or large components. Two components are picked up by the place-
ment head, optically centered on the way to the placement position and rotated into the necessary
placement angle. They are then placed gently and accurately onto the PCB with a controlled blast
of air.
New nozzles (type 5xx) have been developed for the TwinHead. It is also possible to fit an adapter
and then use type 4 nozzles for the Pick&Place head and type 8xx and 9xx nozzles for the Col-
lect&Place heads.
3.5.4.2 Technical data
Optical centering with Stationary P&P component camera
(type 33) 55 x 45, digital
(see Section 3.8.6
, page 160)
Stationary P&P component camera
(type 25) 16 x 16, digital
(see Section 6.7, page 432)
Range of components
a
0402 to SO, PLCC, QFP, BGA, spe-
cial components, bare dies, flip-
chips
0201 to SO, PLCC, QFP, sockets,
plugs, BGA, special components,
bare dies, flip-chips, shields
Component specification
b
max. height
min. lead pitch
min. lead width
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
25 mm (higher available on request)
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0 x 0.5 mm²
55 x 45 mm² (single measurement)
For use with two nozzles
50 x 50 mm² or
69 x 10 mm²
For use with one nozzle
85 x 85 mm² or
125 x 10 mm²
up to 200 x 125 mm² (with restric-
tions)
100 g
c
25 mm (higher available on request)
0.25 mm
0.1 mm
0.14 mm
0.08 mm
0.6 x 0.3 mm²
16 x 16 mm² (single measurement)
100 g
c
User Manual SIPLACE X-Series 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.5 Placement head
135
Programmable set-down
force
1.0 N - 15 N
2.0 N - 30 N
d
1.0 N - 15 N
2.0 N - 30 N
d
Nozzle types 5 xx (standard)
4 xx + adapter
8 xx + adapter
9 xx + adapter
gripper
5 xx (standard)
4 xx + adapter
8 xx + adapter
9 xx + adapter
gripper
Nozzle spacing on the two
Pick&Place heads
70.8 mm 70.8 mm
X/Y accuracy
e
± 26 μm / 3σ, ± 35 μm / 4σ ± 22 μm / 3σ, ± 30 μm / 4σ
Angular accuracy ± 0.05° / 3σ, ± 0.07° / 4σ ± 0.05° / 3σ, ± 0.07° / 4σ
CO camera type 33 25
Illumination level 6 6
Possible illumination level
settings
256
6
256
6
a) Please note that the component range that can be placed is also affected by the pad geometry, the cus-
tomer-specific standards and the packaging tolerances.
b) If the C&P head and TwinHead are combined in a placement area, the maximum dimensions are restricted.
c) If standard nozzles are used
d) SIPLACE High-Force Head, Section 6.6
, page 431.
e) The accuracy value was measured using the vendor-neutral IPC standard.
3 Technical data for the machine User Manual SIPLACE X-Series
3.6 Gantry system From software version SR.605.xx 07/2008 EN Edition
136
3.6 Gantry system
3.6.1 Position of the gantries
3.6.1.1 Position of the gantries for the X4 placement machine
3
Fig. 3.6 - 1 Position of the gantries for the X4 placement machine
P1, P2, P3, P4 (gantry 1, gantry 2, gantry 3, gantry 4)
X1 X axis, gantry 1
Y1 Y axis, gantry 1
X2 X axis, gantry 2
Y2 Y axis, gantry 2
X3 X axis, gantry 3
Y3 Y axis, gantry 3
X4 X axis, gantry 4
Y4 Y axis, gantry 4
(T) Direction of PCB transport
Placement area 2
Placement area 1