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3 Technical data User manual SIPLACE HF series 3.7 Placement heads S oftware Version SR.50x.x x 01/2006 US Edition 122 nozzle a re constantly checke d through out the enti re pick -up and placemen t process in order to k…
User manual SIPLACE HF series 3 Technical data
Software Version SR.50x.xx 01/2006 US Edition 3.7 Placement heads
121
The star rotates about the star axis with its 12 segments. The segments hold the sleeves. There
is a nozzle seated on every sleeve, which sucks up the components, and transports them from
the pick-up/placement position (1) to the reject position (3), to the optical centering position (7) or
to the turning position (9). 3
The Z axis performs a vertical movement. Every sleeve that is in the bottom star position (1) is
raised or lowered by this axis, thus picking up the components from the feeder modules and set-
ting them down on the PCB. The Z axis is an "intelligent axis". It "notes" the pick-up height of
each conveyor track and the placement height for each component. This can speed up the place-
ment process. The programmed placement force remains constant. 3
3
Fig. 3.7 - 5 Description of the functions
The DP axis rotates the optically centered component to the desired placement angle. The se-
quences of movements of the rotation and translation axes are controlled by control circuits. Po-
sition and speed sensors send the actual values for the axis movement to the axis control. The
setpoint and actual values are compared and used to determine the force and speed parameters
for the servo amplifier, and thus the axis movement to be performed. The vacuum values at the
Component camera
DP axis
Rotate component
into placement position
Remove sleeve
or insert
Z axis
Pick up component
or place it
Star axis
Star rotation
Reject component
3 Technical data User manual SIPLACE HF series
3.7 Placement heads Software Version SR.50x.xx 01/2006 US Edition
122
nozzle are constantly checked throughout the entire pick-up and placement process in order to
keep the placement error rate as low as possible. 3
3.7.2.3 Technical data
3
3
*) Please note that the component range that can be placed is also affected by the pad geometry, the customer-specific
standards and the packaging tolerances.
12-segment Collect&Place
head with standard component
camera (24x24)
12-segment Collect&Place
head with DCA camera
Component range *) 0201 to PLCC44, BGA, µBGA,
flip-chip, TSOP, QFP, SO to
SO32, DRAM
0201 to flip-chip, bare die
Component specification
max. height
min. lead pitch
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
6 mm
0.5 mm
0.35 mm
0.2 mm
0.6 x 0.3 mm²
18.7 x 18.7 mm²
2 g
6 mm
0.4 mm
0.2 mm
0.11 mm
0.6 x 0.3 mm²
13 x 13 mm²
2 g
Programmed power stage
1
2
3
4
5
Programmed set-down force [N]
2.4 ± 0.5
2.4 ± 0.5
3 + 1
4 + 1
5 + 1
Nozzle types 9 xx 9 xx
X/Y accuracy ± 45 µm/3 σ, ± 60 µm/4 σ ± 41 µm/3 σ, ± 55 µm/4 σ
Angular accuracy ± 0.5°/3 σ, ± 0.7°/4 σ ± 0.5°/3 σ, ± 0.7°/4 σ
User manual SIPLACE HF series 3 Technical data
Software Version SR.50x.xx 01/2006 US Edition 3.7 Placement heads
123
3.7.3 6-segment Collect&Place head for high-speed IC placement
3
Fig. 3.7 - 6 6-segment Collect&Place head - Function groups, part 1
3
(1) Vacuum generator
(2) Turning station, DP axis
(3) Star with 6 sleeves - star axis
(4) Forced air valve
(5) Silencer