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2 Operational safety User manual SIPLACE HF series 2.11 ESD guidelines S oftware Version S R.50x.xx 01/2006 US Edition 92
User manual SIPLACE HF series 2 Operational safety
Software Version SR.50x.xx 01/2006 US Edition 2.11 ESD guidelines
91
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD
foam, ESD bag or container).
Do not bring modules near visual display units, monitors or televisions. Keep them at least 10 cm
away from the screen.
2.11.4 Measurements and modifications to ESD modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
Æ Always use an earthed soldering iron if you carry out any soldering work.
2.11.5 Dispatching ESD modules
Æ Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film. 2
Æ If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
2 Operational safety User manual SIPLACE HF series
2.11 ESD guidelines Software Version SR.50x.xx 01/2006 US Edition
92
User manual SIPLACE HF series 3 Technical data
Software Version SR.50x.xx 01/2006 US Edition 3.1 Description of the machine
93
3 Technical data
3.1 Description of the machine
3.1.1 Overview
The SMD placement systems from the SIPLACE HF series are characterized by their high config-
uration flexibility, excellent placement rate and maximum precision. The machines cover the SMD
spectrum of components from 0201 to 125 x 10 mm² with a high placement rate.
Two placement methods are used:
–the Collect&Place method with revolver heads for components from size 0201 to fine-pitch
–the Pick&Place method with the SIPLACE TwinHead for fine-pitch and OSC components
3
Fig. 3.1 - 1 HF/3 placement machine, overview