X service技术参数 - 第10页

10 Placement Hea ds Head Modularity Description SIPLACE X machines are char- acterize d by their exc ellent flexibility in the production process. This flexibility is partly d ue to th e head mod- ular ity . Differen t p…

Line Concept

Description

SIPLACE X machines allow a

production line to be individ-

ually configured from a range

of identical and different

modules. As the production

requirements change, the

individual placement

system - which are both mod-

ular and compact - can be

quickly recombined without

great effort.

The SIPLACE X family has ex-

actly the right placement sys-

tem, whatever the output

requirements:

SIPLACE X placement

systems cover the SMD spec-

trum of components from

0201 to 125 x 10 mm² with a

high placement rate.

SIPLACE set-up optimiza-

tion is a tool for increasing

the line's productivity.

The software calculates indi-

vidual set-ups for individual

products, individual set-ups

for different products and

family set-ups for different

products.

The program data can be

exchanged between the indi-

vidual lines - even for

different machine configura-

tions.

System SIPLACE SMD placement lines

Placement

modules

SIPLACE X2, X3 or X4

Peripheral

modules

Input/output stations, screen printers,

soldering ovens, inspection stations, etc,

available from Siemens L&A

Component

range

0201 to 85 x 85 mm² / 125 x 10 mm² max.

200 x 125 mm² (with restrictions). The

range of components depends on which

head configuration is selected.

PCB conveyor Single and dual conveyor with automatic

width adjustment unit;

Dual conveyor in Single conveyor mode;

"Wide board“ mode, "Long board" option

and combinations thereof for both PCB

conveyors. The maximum PCB width is

determined by the module with the small-

est PCB conveyor width.

Space

required

6.0 m² for the X2 module,

6.7 m² per X3 or X4 module

Placement Heads

Head Modularity

Description

SIPLACE X machines are char-

acterized by their excellent

flexibility in the production

process. This flexibility is

partly due to the head mod-

ularity. Different placement

head variants can be config-

ured to suit the production

requirements. The illustra-

tions show the placement

head variants for the SIPLACE

X2, X3 and X4 machines.

Section "Machine Description

- Technical Data - “ from page

5 contains a list of placement

head configurations and

placement rates.

There is also a reconfigura-

tion kit if you wish to change

the placement head locally.

This package contains the

appropriate nozzle changers,

assembly parts, cables, etc, in

addition to the placement

head.

C&P12

C&P6

Placement area 2

C&P20/C&P12/C&P6

C&P20

Placement area 1

SIPLACE X4

SIPLACE X3

C&P12

Placement area 2

C&P20/C&P12/C&P6/TH

C&P20/C&P12/C&P6

C&P6

Placement area 1

C&P20

SIPLACE X2

C&P12

Placement area 2

C&P20/C&P12/C&P6/TH

C&P6

Placement area 1

C&P20

Placement Heads

20-Nozzle Collect&Place Head for

Very High-Speed Placement

Description

The 20-nozzle Collect & Place

head works on the Collect &

Place principle. This means

that, within each cycle,

twenty components are

picked up by the placement

head, are optically centered

on the way to the board and

are rotated into the required

placement angle. Lastly, the

component is placed gently

and accurately on the board.

The 20-nozzle Collect & Place

head succeeds in consider-

ably increasing the output of

the placement head and

thus of the overall place-

ment machine. The high-res-

olution component camera

allows the 20-nozzle Collect

& Place head to optically cen-

ter and place component

sizes ranging from 0201 to 6

x 6 mm².

Checking and self-learning

functions

The reliability of the Collect &

Place head is increased by

various checking and self-

learning functions.

• A component sensor is in-

stalled on the 20-nozzle

Collect & Place head to in-

crease the placement reli-

ability. It checks for the

presence of a component

at the nozzle at the pick-up

and placement position.

• The digital component

camera on the placement

head determines the pack-

age form and the precise

position of each compo-

nent at the nozzle. Any

deviations from the re-

quired pick-up position are

corrected before place-

ment takes place.

• A sensor registers the rela-

tive movement between

nozzle and segment while

setting down compo-

nents, and sends a signal

to the axis controller to

regulate the position. With

this sensor stop method,

differences in height dur-

ing pick-up and any un-

evenness of the PCB

surface are compensated

during placement.

Star

rotation

Pick up compo-

nent and place it

Turn component

individually

Optically center

component

Check

vacuum

Component

sensor

Component

sensor

Star motor

Star with

20 nozzles

Component

camera