X service技术参数 - 第11页

11 Placement Heads 20-Noz zle Coll ect & Place Head fo r Very High-Speed Placem ent Description The 20-nozzle Collect & Place head works on the Collect & Place principle. Thi s means that, w ithin each cy cle…

Placement Heads

Head Modularity

Description

SIPLACE X machines are char-

acterized by their excellent

flexibility in the production

process. This flexibility is

partly due to the head mod-

ularity. Different placement

head variants can be config-

ured to suit the production

requirements. The illustra-

tions show the placement

head variants for the SIPLACE

X2, X3 and X4 machines.

Section "Machine Description

- Technical Data - “ from page

5 contains a list of placement

head configurations and

placement rates.

There is also a reconfigura-

tion kit if you wish to change

the placement head locally.

This package contains the

appropriate nozzle changers,

assembly parts, cables, etc, in

addition to the placement

head.

C&P12

C&P6

Placement area 2

C&P20/C&P12/C&P6

C&P20

Placement area 1

SIPLACE X4

SIPLACE X3

C&P12

Placement area 2

C&P20/C&P12/C&P6/TH

C&P20/C&P12/C&P6

C&P6

Placement area 1

C&P20

SIPLACE X2

C&P12

Placement area 2

C&P20/C&P12/C&P6/TH

C&P6

Placement area 1

C&P20

Placement Heads

20-Nozzle Collect&Place Head for

Very High-Speed Placement

Description

The 20-nozzle Collect & Place

head works on the Collect &

Place principle. This means

that, within each cycle,

twenty components are

picked up by the placement

head, are optically centered

on the way to the board and

are rotated into the required

placement angle. Lastly, the

component is placed gently

and accurately on the board.

The 20-nozzle Collect & Place

head succeeds in consider-

ably increasing the output of

the placement head and

thus of the overall place-

ment machine. The high-res-

olution component camera

allows the 20-nozzle Collect

& Place head to optically cen-

ter and place component

sizes ranging from 0201 to 6

x 6 mm².

Checking and self-learning

functions

The reliability of the Collect &

Place head is increased by

various checking and self-

learning functions.

• A component sensor is in-

stalled on the 20-nozzle

Collect & Place head to in-

crease the placement reli-

ability. It checks for the

presence of a component

at the nozzle at the pick-up

and placement position.

• The digital component

camera on the placement

head determines the pack-

age form and the precise

position of each compo-

nent at the nozzle. Any

deviations from the re-

quired pick-up position are

corrected before place-

ment takes place.

• A sensor registers the rela-

tive movement between

nozzle and segment while

setting down compo-

nents, and sends a signal

to the axis controller to

regulate the position. With

this sensor stop method,

differences in height dur-

ing pick-up and any un-

evenness of the PCB

surface are compensated

during placement.

Star

rotation

Pick up compo-

nent and place it

Turn component

individually

Optically center

component

Check

vacuum

Component

sensor

Component

sensor

Star motor

Star with

20 nozzles

Component

camera

Placement Heads

12-Nozzle Collect & Place Head for

High-Speed Placement

Description

The 12-nozzle Collect & Place

head works on the Collect &

Place principle. This means

that, within each cycle,

twelve components are

picked up by the placement

head, are optically centered

on the way to the board and

are rotated into the required

placement angle. Lastly, the

air kiss sets down the compo-

nent gently and accurately

on the board.

Checking and self-learning

functions

The reliability of the Collect &

Place head is increased by

various checking and self-

learning functions.

• For example, vacuum

checks at the nozzles indi-

cate whether the compo-

nent was picked up or set

down correctly.

•A digital component cam-

era on the placement head

determines the precise

position of each compo-

nent at the nozzle. Any de-

viations from the required

pick-up position are cor-

rected before placement

takes place.

• The package form is also

checked and the compo-

nent is not placed if the

geometric data thus deter-

mined differs from the

programmed data.

The vertical axis for picking

up and placing the compo-

nent works in sensor stop

mode, in which differences

in height during pick-up and

any unevenness of the PCB

surface are compensated

during placement.

In addition to the vacuum

check, an optional compo-

nent sensor may be used to

check for the presence of a

component at the nozzle.

The use of a component sen-

sor is recommended, particu-

larly when placing small

components, such as 0201.

"High-resolution camera“

option

The high-resolution compo-

nent camera allows the

12-nozzle Collect & Place

head to optically center and

place component sizes rang-

ing from 0201 to 18.7 x

18.7 mm².

Component vision module

DP axis:

Rotate component

to placement angle

Pull off or

insert sleeve

Z axis

Pick up or

place component

DR axis:

Rotate star

Reject

component