X service技术参数 - 第34页

34 Comp onent Fee ding Matrix Tray Changer Technical data Electrical ratings Noise emissions Permitted environmental factors Supply voltage 3 x 400 VAC, 50 Hz (Europe) 3 x 208 VAC, 60 Hz (USA) Total power 1.5 kW Rated cu…

Component Feeding

Matrix Tray Changer

Technical Data

* Waffle-pack tray carrier

Tray supply 1 (XL) Tray supply 2

Dimensions

Length x width

Height

1305 x 600 mm²

1490 mm for 830 mm PCB transport height

1560 mm for 900 mm PCB transport height

1590 mm for 930 mm PCB transport height

1640 mm for 950 mm PCB transport height

Weight (basic equipment) approx. 500 kg (with PCB magazines

and waffle tray carriers)

Weight (fully equipped) approx. 534 kg (with components)

Weight (moving mass) approx. 80 kg approx. 43.5 kg

PCB magazine size (L x W x H) 391.2 x 305.6 x 93.3 mm³ 352.7 x 154.8 x 133.8 mm³

PCB magazine weight

(fully equipped)

(without waffle tray carrier)

approx. 11 kg

approx. 1.7 kg

approx. 7.5 kg

approx. 1.35 kg

Weight of the

waffle tray carrier

850 g 150 g

Dimensions of the

waffle tray carrier (L x W x H) 386.5 x 295.8 x 11.1 mm³ 371 x 146 x 10.1 mm³

Distance from PCB magazine to

magazine

96 mm 135 mm

Distance from level to level 12 mm 11.8 mm

Vertical travel 444 mm (1st to 30th waffle

tray carrier)

511.2 mm (1st to 40th waffle

tray carrier)

Horizontal travel between out-

going and pick-up position approx. 647 mm approx. 638 mm

Storage capacity 30 XL waffle-pack tray

carriers with 60 JEDEC or

30 special magazines of

maximum size

40 waffle tray carriers with

40 JEDEC waffle trays

Changeover time (over 5 levels) approx. 2 sec approx. 1.5 sec

Max. height of component and

waffle tray, including tolerances

all levels filled

one level free

two levels free

8.5 mm

19.5 mm

31.5 mm

8.5 mm

19.5 mm

Component Feeding

Matrix Tray Changer

Technical data

Electrical ratings

Noise emissions

Permitted environmental factors

Supply voltage 3 x 400 VAC, 50 Hz (Europe)

3 x 208 VAC, 60 Hz (USA)

Total power 1.5 kW

Rated current 2.7 A at 3 x 400 VAC

4.2 A at 3 x 208 VAC

Fuses 3 x 16 A

Rated power consumption of the largest consumer 2 A

Maximum noise emissions 74 dB (A)

Room temperature between 15 °C and 35 °C

Atmospheric humidity 30 - 75 %

(No higher than 45% on average to prevent any

possibility of condensation on the machine)

Vision Sensor Technology

PCB Position Recognition

Technical data

PCB fiducials

Local fiducials

Library memory f. recogni-

tion of bad panels

up to 3 (subpanels and multiple

panels)

up to 2 per PCB (may be of dif-

ferent type)

up to 255 types of fiducials per

subpanel

Image analysis Edge detection method (geo-

metric alignment) based on

gray-scale values

Lighting method Front lighting

Fiducial recognition time 0.4 s

Field of vision 5.7 x 5.7 mm

Camera’s field of view

Pixel

Ink spot, e.g. square

Evaluation window

Geometrical Alignment

With these data the PCB

vision module is able to

search and recognize the

fiducial at the predefined

position on the PCB or ceram-

ic substrate without further

assistance. For this reason it

places several small evalua-

tion windows at the assumed

border of the fiducial. Within

these evaluation windows

the vision system looks for

contrast transitions between

bright and dark. After finding

such contrasts the actual

position of the fiducial can be

assigned by comparison with

the predefined – and thus

known – shape and size.

The analysis operations can

be used to determine any off-

set with respect to the

DESIRED position in the X and

Y directions and the angular

position.

Saving the fiducial by teach-

ing is not necessary any

more.

Additional functions of the

PCB vision module are recog-

nition of the position of the

feeder modules and ceramic

substrate (optional) and

recording of the machine

data including mapping.

The bad board detector

(GOOD/SCRAP scan) is also

moved over the ink spot

using the PCB vision module.

Description

SIPLACE has a number of

vision modules and a central

vision system to evaluate the

recorded image data ensur-

ing high placement accuracy.

At the machine's X-gantry

the PCB vision module is

mounted. It is used to find

the PCB's positioning-offsets

within the conveyor system.

This vision module is also

required to measure the

machine origin and/or the

feeder module positions on

one side of the table. Each

vision module consists of a

single CCD camera with inte-

grated lighting and optics.

The offsets in the position of

the PCBs are determined with

the help of at least two but

generally three reference

fiducials on the PCB. When

the PCB arrives at the place-

ment area the positioning

system with its PCB vision

module moves to the pro-

grammed fiducial.

The edge detection method

allows to choose predefined

fiducials from a menu (e.g.

cross, circle, square). The size

of the fiducial is programmed

at the station computer.

From this time on form and

size of the fiducial is defined

and known.